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Chinese Manufacturers Amoi and TCL Leverage TI Technology for Handsets Shipping Around the Globe

TI Marks a Decade of Support for China's Booming Wireless Market

Sep 25, 2007

TI Marks a Decade of Support for China's Booming Wireless Market

SHANGHAI (Sept. 25, 2007) - Texas Instruments Incorporated (TI) (NYSE: TXN) today announced that two Chinese manufacturers are using TI integrated wireless technology for handsets shipping worldwide today. Amoi Electronics Co., Ltd. and TCL Communications Technology Holdings Limited (TCL) are using TI technology to bring a range of handsets to consumers around the world, from ultra low-cost phones to affordable, feature-rich smartphones. Amoi and TCL join a premier list of China-based TI customers, including Bird, Konka and Lenovo. TI is a long-time supporter of local Chinese manufacturers and was among the first wireless chipset suppliers to support the booming China mobile phone market with its first mobile phone design-win in 1998. Today's announcement builds on the long-term relationship TI already enjoys with Amoi and TCL.

Amoi continues to expand its series of EDGE handsets which are based on TI's OMAPV1030 EDGE solution, to deliver affordable smartphones for China and Europe. The OMAPV1030, part of TI's OMAP-VoxTM family, is an integrated and optimized EDGE solution giving handset manufacturers the freedom to design affordable devices with the latest applications for the growing mid-range mobile phone market. Manufacturers such as Amoi are leveraging the OMAPV1030 solution to build smartphones at feature phone price points, giving more consumers access to these products, including those in high-growth economies and other cost-sensitive environments, such as small and medium-sized businesses.

"Amoi is very excited to deliver mass-market smartphones to more consumers than ever before," said Mr. Xie, Vice President, Amoi Electronics, Co, Ltd. "By using TI's OMAPV1030 solution, we are able to deliver feature-rich, enhanced multimedia smartphones for multiple markets at an affordable price."

TCL continues to leverage TI's 2.5G and DRPTM technology-based LoCostoTM single-chip solution as part of its roadmap to address the growing requirement for low-cost handsets. TCL selected the LoCosto single-chip platform to address a variety of region-specific operator requirements, end-user feature requirements and cost expectations in several high-demand markets around the globe. The LoCosto platform is a scalable family of solutions that enables manufacturers to deliver differentiated handsets for multiple market segments using the same technology platform. The LoCosto family has also become a platform for innovation, with multiple third parties developing advanced multimedia applications for the entry-level handset segment, such as 1.3 megapixel camera, MP3 playback and video.

"TCL has an increasingly global customer base with different user requirements and demands. TI's LoCosto platform has allowed us to maximize our engineering investment while enabling multiple products from a single platform," said Dr. Fei Liu, CEO of TCL Communication Technology Holdings Limited. "TI's scalable, flexible platform gives us the ability to deliver fashionable, affordable handsets for a variety of market needs - from Asia, to Europe and the Americas."

TI Committed to China Wireless Market

These design wins further illustrate TI's commitment to delivering innovative solutions for the China mobile phone market. In 2001, TI founded its Shanghai wireless design center, which it later extended to Beijing and Shenzhen. The following year, TI co-founded COMMIT, a joint venture aimed at growing China's 3G TD-SCDMA market. And most recently, TI received an award from the China Center of Electronics and Information Industry Development Research for "Outstanding Performance in the China Handset Industry" as part of the organization's China Handset Market 20th Anniversary ceremony.

As part of his remarks to Chinese technology innovators attending a TI-hosted China Wireless Summit in Shanghai today, Greg Delagi, senior vice president of TI's Wireless Terminals Business Unit, said: "With its insatiable entrepreneurial appetite, China is at the center of technology innovation and mobile development. A long-time supporter of the China market, TI is proud to continue working alongside our China customers as the Chinese market continues to boom, and remain wholly committed to investing in our customers' success."

TI is one of the leading wireless semiconductor suppliers to Chinese OEMs, with 7 of the top 8 local Chinese manufacturers using TI wireless technology. Additionally, 14 of the top 15 Asian ODMs and OEMs have chosen TI wireless technology, including Chi Mei, Compal, HTC and LGE.