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TI Senior Vice President Gilles Delfassy to Deliver Keynote at Lehman Brothers Investor Conference

Live Webcast at www.ti.com/ir May 22, 2006, noon Eastern Daylight Time

May 16, 2006

DALLAS (May 16, 2006) – Texas Instruments Incorporated (TI) (NYSE:TXN) announced that Gilles Delfassy, senior vice president and manager of TI’s semiconductor wireless terminals business unit, will deliver a keynote address at the 2006 Lehman Brothers Worldwide Wireless and Wireline Conference in New York on Monday, May 22, at noon EDT. Delfassy will discuss TI's semiconductor strategy for the cell-phone market and how the company uses its capabilities in DSP and analog to position it for growth across a range of wireless opportunities.

The audio webcast can be accessed live through the Investor Relations section (http://www.ti.com/ir) of TI's website. Archived replays are available for 1 week.

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Texas Instruments Incorporated provides innovative DSP and Analog technologies to meet our customers’ real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

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