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Texas Instruments Extends Third Party Network to Meet Needs of Residential Gateway and Consumer Electronics Manufacturers

Third Party Partners Help OEMs and ODMs Quickly Deliver Differentiated Products

Mar 1, 2006

DALLAS (March 1, 2006) - Demonstrating its commitment to helping residential gateway (RG) and consumer electronics (CE) manufacturers get to market quickly with innovative products, Texas Instruments Incorporated (NYSE:TXN) (TI) today announced it has broadened the scope of its Third Party Network to include the capabilities and offerings specific to the needs of the RG and embedded systems markets.
"TI's residential gateway and consumer electronics customers are constantly looking for ways to shorten development time and deliver unique, new products to market quickly, and TI's growing third party network has proven very successful at enabling them to accomplish this to provide broadband access to and throughout the digital home," said Ben Sheppard, Customer and Partner Marketing Manager for TI's Residential Gateway and Embedded Systems Group. "Our RG and embedded systems groups are working closely with these partner companies to help them deliver the support and solutions these manufacturers want in order to quickly and effectively leverage TI's advanced signal processing solutions."
Companies building RG or CE products can now leverage existing TI third party network members Ittiam, Softier and eSOL for system integration, hardware and software differentiation on TI's RGES platforms. These members join previously announced third parties Ashley Laurent for RG software and Litepoint Corporation for WLAN testing equipment, as well as a new member, AwoX, a provider of home networking middleware and applications software, also announced today.
"As the attendance and participation at this week's TI Developer Conference demonstrates, OEMs and ODMs continue to look to our partners to help them quickly leverage TI's advanced signal processing-based silicon and software platforms to deliver unique, innovative products to the market," said Jennifer Skinner-Gray, WW DSP Partner Network, TI. "Now, RG and CE manufacturers also benefit from this vast network."
The 2006 TI Developer Conference (TIDC) features the latest in high-performance digital signal processing, high-performance analog and microcontroller system designs. TI CEO Rich Templeton will be joined by industry leaders, embedded designers, engineers, project managers, educators and other TI executives from around the world for the conference, held from February 28 - March 2, 2006 at the Hyatt Regency in Dallas, Texas. For more information, visit www.ti.com/tidc2006