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Texas Instruments Samples 3G Solution Jointly Developed with NTT DoCoMo

Leading 3G Handset Manufacturers to Develop Handsets Based on the New OMAPV2230 UMTS Solution

Nov 28, 2005

TOKYO (November 28, 2005) - Fulfilling a commitment made last year to jointly develop 3G solutions with NTT DoCoMo, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced it has sampled a cost-competitive, multi-mode UMTS chipset developed with NTT DoCoMo to serve the worldwide 3G handset market. Part of TI's OMAP-VoxTM architecture, the new OMAPV2230 solution is an integrated UMTS dual-mode digital baseband processor and advanced applications processor based on TI's high-performance OMAPTM 2 architecture, TI's proven GSM/GPRS technology, and NTT DoCoMo's established WCDMA technology. 
This 3G collaboration builds upon this long-standing relationship between TI and NTT DoCoMo and further strengthens TI's lead in the 3G marketplace. With more than 15 million 3G subscribers, NTT DoCoMo is the worldwide leader in this growing 3G marketplace. To date, the majority of NTT DoCoMo's 3G FOMATM handsets have benefited from TI's OMAP processor technology to provide FOMA subscribers with advanced applications and services. 
"The new OMAPV2230 solution will help NTT DoCoMo expand its 3G FOMA subscriber base by offering more affordable 3G handsets with the most advanced multimedia applications allowing a richer user experience with mobile digital TV, music and gaming," said Koji Chiba, Managing Director of Customer Equipment Development Department, NTT DoCoMo. "NTT DoCoMo is pleased to achieve this next step in our 3G collaboration with TI. With our combined best-in-class systems expertise, NTT DoCoMo and TI have developed the cost-efficient OMAPV2230 to drive widespread adoption of 3G phones delivering high-performance multimedia applications."
Part of TI's OMAP-Vox wireless platform, the OMAPV2230 solution takes advantage of the latest advancements of the OMAP 2 architecture and will deliver the latest in 3G mobile entertainment applications, such as video at VGA 30 frames per second, up to 5-megapixel camera, interactive 3D gaming, digital camcorders and mobile TV. Additionally, the OMAPV2230 solution enables optimized multimedia services. As part of TI's wireless roadmap, the OMAPV2230 device will include multi-mode EDGE and HSDPA based on TI technology. This is TI's second-generation of processors to use 90-nanometer technology.
"The new product jointly developed by TI and NTT DoCoMo will accelerate further expansion of 3G mobile handsets featuring various mobile entertainments including the latest gaming and TV conference," said Tatsuru Kojima, General Manager of Mobile Terminal Division, NEC. "We expect that with their new product, we could broaden the choices to expand our business in the global market."
"Panasonic is pleased to leverage TI and NTT DoCoMo technology to extend the current leading-edge multimedia application to the UMTS market. With this solution, it makes it possible to develop cost-efficient 3G mobile phones and Panasonic is excited to expand the 3G handset usage in the worldwide market" said Toshinori Hoshi, Member of the Board, Director of Mobile Terminal Division 1 of Panasonic.
The OMAPV2230 solution is the first UMTS solution in TI's OMAP-Vox wireless platform, which merges both modem and advanced application processing functionality onto the existing OMAP architecture and allows manufacturers to easily reuse investments across multiple market segments and air interfaces. OMAP-Vox solutions share a common software platform that can be re-used for a variety of growing market requirements to bring overall development costs down. The OMAP-Vox platform provides a natural migration path for TI's 2.5G customers and saves years of design effort so manufacturers can quickly and cost-effectively deliver 3G handsets to the mass market.
"TI is proud to work with industry leaders like NTT DoCoMo, NEC and Panasonic," said Alain Mutricy, TI's vice president and general manager of Cellular Systems for its Wireless Terminals Business Unit. "With more than 50 percent share of the UMTS semiconductor marketplace, TI continues to lead in 3G in 2005. The launch of the new OMAPV2230 device will strengthen our lead by providing a standard solution for manufacturers."
Like all of TI's OMAP processors, the OMAPV2230 solution is supported by the OMAP Platform Ecosystem, a worldwide network of application software developers, system integrators and development tool providers. The OMAPV2230 device is capable of supporting high-level operating systems such as Linux®, Symbian OSTM, Windows MobileTM, as well as real-time operating systems such as NucleusTM
Manufacturers are currently designing handsets based on the OMAPV2230 solution, and products are expected on the market in 2006. As part of TI's 3G roadmap, TI is also developing OMAP-Vox UMTS solutions designed to address additional product categories within the smartphone, featurephone, and ultra-low-cost market segments.