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Texas Instruments Salutes USTR for New MCP Agreement

Nov 3, 2005

DALLAS (November 3, 2004) -- Texas Instruments Incorporated (TI) (NYSE: TXN), has applauded the successful efforts by U.S. Trade Representative Rob Portman to bring agreement among five key trading nations on MCPs (multi-chip packages).

TI’s President and CEO Richard K. Templeton said, “The agreement to abolish tariffs on multi-chip packages is another great victory for USTR. The MCP agreement eliminates a barrier that could have hindered growth in this fast growing product sector. I applaud Ambassador Portman and his negotiators for their perseverance in securing this agreement.”

The World Semiconductor Council (WSC) has been central to the semiconductor industry’s efforts to create an agreement. The WSC is composed of members of the Semiconductor Industry Association (SIA) as well as representatives from Japan, Korea, Europe and Taiwan.

The agreement eliminates duties in the U.S. (2.6%), EU (up to 3.8%), and Korea (2.6%) and prevents imposition of duties in Japan and Taiwan.

Said TI’s Vice President of Government Relations Paula Collins, “Today this agreement is good for our industry because it includes the majority of the trade in these products. And tomorrow it forms the basis for more extensive efforts within the WTO. These are cutting edge products where U.S. companies are in a leadership role. This agreement will help keep us in that position.”

About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Education Technology. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com.