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Texas Instruments and China's Wireless Industry Leaders Gather to Discuss State of Wireless in China

Top Chinese Government Officials, Scholars to Discuss 2.5G, 3G Mobile Communication Strategies at TI's Wireless Technology Summit

Oct 18, 2005

BEIJING, CHINA (October 18, 2005) - Leaders from Texas Instruments Incorporated's (NYSE:TXN) (TI) wireless business, officials from the China Institute of Communications (CIC), and more than 150 executives, managers and engineers from leading wireless device manufacturers and operators in China, will assemble Thursday to discuss the state of China's wireless industry. TI and CIC will co-organize the Wireless Technology Summit, co-located with Beijing's PT/Wireless & Networks Comm China 2005, to provide an opportunity for TI executives and China's wireless industry leaders to discuss requirements of China's dynamic mobile communications market.
In opening remarks at the event, Gerald Kuo, director and general manager of Texas Instruments China, and Liu Cai, CIC vice chairman and secretary general, will underscore TI's commitment to advance China's technology market and the pivotal role China will play in the growth of wireless technology.
"TI is hosting a 'meeting of the minds' to look at the future of wireless communications and the role that TI and China manufacturers together can play in this market," Kuo said. "China's cellular market is at the cusp of rapid expansion, with high growth anticipated over the coming years. To realize this growth it will take continued collaboration and innovation amongst wireless leaders"
CIC's Cai added, "China's mobile phone industry continues to have a big space for future growth. In the coming few years, the number of China mobile subscribers will increase to 50 million people per year. With the growth of the user base and voice service, the business for mobile data, other non-voice services and new applications will thrive. Stronger cooperation and technology innovation among communication networking operators, equipment and system developers and content providers will be the key to maintaining the fast growth of the wireless communications market."
According to market analysts, high growth is anticipated for emerging markets like China. Technology research firm Forward Concepts indicates that between 2004 and 2008 there will be a 26 percent growth in China's wireless subscriber base compared to industry growth of 23 percent (April 2005). This represents a great opportunity for delivering mobile services to a largely untapped market. TI's roadmap of 2.5G and 3G wireless solutions, including its single-chip cell phone solution, will enable players in the wireless value chain to capitalize on the growing opportunities in China and other emerging markets worldwide.
Scholars, government officials and TI executives will address conference attendees and outline the state of wireless communications in China. Zemin Yang, president, China Academy of Telecommunications Research, Ministry of Information Industry, will deliver remarks on wireless technology development and standards establishment in China. In addition, Tingjie Lu, dean, School of Economics and Management at the Beijing University of Posts and Telecommunications, will share his views on China's wireless trends and policies.
TI wireless experts will highlight the company's latest wireless technology achievements, including its revolutionary DRPTM technology, which significantly reduces cost, power requirements, board area and silicon area - critical factors for designing high-volume, entry-level mobile phones. It will also provide an overview of its OMAPTM 2 architecture, which enables mobile entertainment applications and services that will drive mass adoption of 3G services. Other topics will include the importance of mobile applications suites for product differentiation and maximizing handset connectivity via Bluetooth, WLAN and mobile TV technology. 
The wireless summit underscores TI's commitment to provide wireless solutions tailored to the needs of emerging markets worldwide. Drawing upon more than 15 years of wireless systems expertise, TI is the worldwide leader in developing 2.5G and 3G wireless solutions. The company's success is evident in the numbers. Worldwide, more than 1.7 billion handsets have shipped with a TI digital baseband and 250 million 2.5G cellular system chipsets have shipped to more than 35 customers. In addition, TI technology is in more than 50 percent of 3G handsets in the marketplace today and is used by 6 of the top 7 global 3G handset manufacturers.

TI at PT Wireless

TI will exhibit its latest wireless technology at booth #5D01, Hall 5, during PT Wireless 2005 at the China International Exhibition Centre, held October 18-22.