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TI Unveils Single Chip Multi-Carrier Mixed Signal Processor for 3G Wireless Infrastructure Applications

Most Integrated Diversity Processor Targets Wide-Band Radio Solution

Oct 20, 2005

BEIJING, China (Oct. 20, 2005) - Texas Instruments Incorporated (TI) [NYSE:TXN] today introduced the industry's most integrated, highest performance diversity mixed signal receive processor for 3G base stations and fixed wireless communication devices. TI's AFE8406 multi-carrier chip integrates a dual 14 bit 85 MSPS (mega samples per second) analog-to-digital converter (ADC) and sixteen channels of programmable digital down conversion (DDC) into a single device.
Leveraging TI's high performance, advanced technology, this multi-channel communication signal processor offers increased density, resulting in lower costs for systems supporting a range of 3G standards. The multiple DDC channels allow a larger number of carriers per signal chain, translating to significantly reduced implementation costs. TI's AFE8406 can be configured to support up to four-carrier UMTS, eight-carrier CDMA or eight-carrier TD-SCDMA diversity receivers.
"The release of the 3G spectrum in China will create a large demand for advanced wireless infrastructure applications, providing the next-level of mobile telecommunications services and features to the world's largest cellular market," said David Briggs, TI's analog wireless infrastructure business manager. "TI has responded to the wireless infrastructure designers' needs for enhanced integration, higher performance and increased density for 3G applications with its new AFE8406."

TI's AFE8406 delivers outstanding intermediate frequency (IF) performance with extremely low noise to enable multi carrier operations. At an input frequency of 140 MHz, the device delivers signal-to-noise ratio (SNR) of greater than 68 dB, and spurious free dynamic range (SFDR) of greater than 70 dBc. The AFE8406 continues to build on TI's existing portfolio of state-of-the-art signal chain solutions:

  • GC5018, an eight channel wide band down converter with front end/back end AGC; GC5016, a four channel digital down/up converter. 
  • GC1115, crest factor reduction processors. 
  • ADS5411-11bit 105MSPS and ADS5545, high speed analog-to-digital converters, 14 bit 170MSPS. 
  • DAC5687, a dual 16 bit 500MSPS, high-speed digital-to-analog converters. 
  • TRF3761 frequency synthesizer and TRF3702 RF quadrature modulator.

For developers using the


, TI provides an evaluation module (EVM) for easy integration of the device into wireless infrastructure base stations and other targeted applications. The EVM is complemented with the easy to use GC Studio software for data analysis.



is available in a 484-pin 23 mm x 23 mm ball grid array (BGA) package. Samples are available now with projected production in 1Q 2006. For more information on this product and TI's complete portfolio of wireless infrastructure solutions, visit