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Texas Instruments' DSP Contest cultivates technology innovation

May 23, 2008

BEIJING (May 23, 2008) - The 2008 Texas Instruments (TI) (NYSE: TXN) Digital Signal Processing (DSP) Design Contest was held at the University of Electronic Science and Technology of China on April 25 - 27.

Hefei University of Technology was selected as the first prize winner for its project titled, "Real-time fatigue driving monitoring system based on TI's DM642," in the System Design category. Fudan University was awarded first prize for its project titled, "Realization and optimization of video tracking algorithm in DaVinci SoC," in the Algorithm category.

"The contest is a testament of the cooperation between TI and universities across China over the past decade," said Dr. Kun-Shan Lin, vice president, TI. "This competition involves a large number of participants and reaches across a multitude of applications. The level of the projects submitted for the contest display exceptional academic and technological innovation."

As the highest level DSP competition in China, the event is designed to help Chinese college students develop a deeper understanding of digital signal processing design; encourage engineering majors to create innovative designs utilizing DSPs; encourage engineering students to put design theory into practice; and foster communication among universities regarding DSP research and development (R&D).

The competition attracted over 200 teams from more than 130 universities this year, making it the largest participation in the contest's history. After the preliminary round, 44 teams were selected to participate in the last round of the competition. Teams selected for the final round competed in three areas: overall project review, oral defense of the project and project demonstration. A panel of industry experts evaluated each teams' project and selected the winning entry.

Dr. Kun-Shan Lin, TI vice president; Dr. Gene A. Frantz, TI principle fellow; Eldon Teng, Asia business development director; Shen Jie, manager of TI's Asia University Program; Zhu Hong, vice president of the University of Electronic Science and Technology of China; and Li Yuemin, academician of Chinese Academy of Engineering presented award medals to the winners at an award ceremony.

TI, a U.S. based global semiconductor company, is a leading designer and supplier of digital signal processing and analog technology. Its China University Program enjoys extensive influence in the industry and academic field through more than 166-DSP technology centers, training centers and joint labs in 147 domestic colleges and universities. Supporting quality education and technology innovation, TI has expanded its University Program to the field of analog technology and and microcontrollers and continues to drive the education of the latest semiconductor technology in Chinese campuses.