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TI Announces New 4mm x 4mm DFN Package for High-Precision Industrial Op Amp

Unique Die Pad Effectively Dissipates Heat

Apr 21, 2005

DALLAS (April 21, 2005) - Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced a new 4mm x 4mm DFN package version of the high-precision OPA277 operational amplifier (op amp) from the company´s Burr-Brown product line. The OPA277 features an excellent combination of offset, drift and noise characteristics. This leadless, near-chip-scale package is less than 1mm thick and features contacts on only two sides, thereby minimizing board space requirements and enhancing thermal characteristics through an exposed pad. The DFN package can be easily mounted using standard PCB assembly techniques. (See www.ti.com/sc05093.)

The OPA277's reduced package size allows compact designs in a variety of applications including industrial electronics, temperature measurement, battery-powered instruments and test equipment, and helps preserve precision by keeping the chip temperature low as the power is easily dissipated through the exposed pad. Additionally, the OPA277 features ultra low offset voltage (35uV typical) and drift, low bias current, high common-mode rejection and higher power supply rejection. The device also offers high open-loop gain and a wide supply range (to +/-18V).

Available Today

The OPA277 (single) and OPA2277 (dual) are available in 4mm x 4mm DFN packages. The single and dual versions are priced at $0.85 and $1.65 respectively in 1,000 piece quantities (suggested resale pricing) and are available now from TI and its authorized distributors. 

TI offers analog engineers a wide-ranging support infrastructure that includes training and seminars, design tools and utilities, technical documentation, evaluation modules, an online KnowledgeBase, a product information hotline and a comprehensive offering of samples that ship within 24 hours of request. For more information on TI´s complete analog design support, and to download the latest Amplifier Selection Guide, visit