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Asian Manufacturers Choose Texas Instruments Technology for Wireless 2.5G and 3G Mobile Devices

TI Drives Local Innovation in Asia by Providing Full System Solution and Testing, Speeding Customer Time to Market

Jun 1, 2004

DALLAS and TAIPEI (June 1, 2004) -- In a keynote address delivered at IAFA 2004 Computex today, Terry Cheng, President of Texas Instruments Incorporated Asia Limited, an Asia subsidiary of Texas Instruments Incorporated (TI) (NYSE:TXN), highlighted TI's commitment to Asian manufacturers of wireless devices. During Cheng's remarks, he reinforced that together with its local customers, TI is driving wireless platform innovation in Asia, from voice-centric to the more complex multimedia demands of 3G.
TI's position and commitment are eflected in the numbers: Ten of the top 15 Asian OEMs and ODMs have chosen TI wireless technology, with TI's OMAPTM processors designed-in at leading Asian ODMs and OEMs, including BenQ, Compal Communications, Chi Mei Communication Systems, HTC, and LG Electronics, making it the number one supplier to ODMs in Taiwan. Further, ten of the top 12 local China OEMs have selected TI for their wireless technology, including Amoi Electronics, Capitel, Eastern Communications (EastCom), Legend (Lenovo), Konka, Ningbo Bird, and ZTE.
"TI believes Asia is experiencing significant global wireless trends, including the need for seamless mobility and connectivity and immediate access to multiple forms of voice and data," said Cheng. "As demand grows for applications and market size, we will see ever-increasing amounts of innovation devoted to the wireless platform. To help our local customers succeed in this dynamic environment, TI has become an innovation engine and has increased its application support for customers, including Taipei and Shanghai wireless support design centers committed to developing 3G multimedia terminal solutions for the Asia market."
TI's current leadership in the Asia wireless market continues a tradition begun in 1998 when TI helped design the first Taiwan ODM wireless handset that went into volume production. Through its involvement in COMMIT, a research and development joint venture with Chinese handset manufacturers, TI is enabling next generation chipset solutions for the China market. Also important for driving 3G growth in China, TI expects to deliver the first TD-SCDMA chipset before the end of 2004, supporting China's 3G wireless standard, and is growing its wireless portfolio with cdma2000® 1X and cdma2000® 1xEV-DV products announced last year. These are important technologies for Asian operators for both their current network and for the evolution of their network to support efficient high speed packet data services.

TI Offers Highly Integrated Turn-Key Silicon and Software Solutions

TI's wireless systems know-how drives significant value for TI customers in the form of hardware and software solutions designed specifically for the wireless environment. Specifically, TI works closely with its local mobile ODM and OEM customers to pre-certify TI's technology platforms, including proof-of-concept demos which allow lab tests and field trials of new wireless standards and services. Customers can also leverage TI's knowledge base through complete hardware and software reference designs that are layout and bill-of-materials optimized for volume production across all network standards.

"BenQ's collaboration with TI is allowing us to build devices with the features and functionalities our customers are demanding," said Irwin Chen, Vice President and General Manager of BenQ, Networking and Communications Business Group. "In fact, TI's OMAP application processors and TCS wireless GSM/GPRS technology is powering the P30, the first smartphone from BenQ. We anticipate this successful collaboration to continue, as BenQ and TI work together to empower people to connect and communicate in ways we have yet to imagine."

TI delivers complete chipsets for all major cellular standards, including GSM; GPRS; EDGE; UMTS, which includes WCDMA; cdma2000® 1X; and cdma2000® 1xEV-DV. This streamlined approach to complete system solutions and testing, as well as TI's broad technology portfolio, means significant reductions in testing time and associated costs, accelerated deployment of next generation standards and faster time to market with revenue-generating technologies.

TI at Computex

TI will exhibit at booth T203AB in hall 4 (TICC) during Computex Taipei, held June 1-5. Key TI executives will be available to provide information on the company and the WLAN, broadband, wireless, PCI and power management programs. In addition to Cheng's keynote, Randy Roberson, TI general manager of Wireless Networking, is also providing a keynote address during Computex Digitimes Forum 2004. In his keynote, Roberson will outline Wi-Fi growth opportunities, including how smaller, power-efficient solutions will drive Wi-Fi into consumer electronics mobile devices and broadband home networking applications.