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TI and Aeluros Announce Strategic Second-Sourcing Alliance for 10 Gbps XFP Applications

Low-Power XFI-to-XAUI Device Enables Widespread XFP Adoption in 10GE and 10G Fibre Channel Markets

May 14, 2004

DALLAS (May 14, 2004) - Meeting the needs of designers of 10 Gigabit Ethernet (10GE) and 10 Gigabit (10G) Fibre Channel applications, Texas Instruments Incorporated (NYSE:TXN) (TI) and Aeluros, Inc. today announced the formation of a strategic alliance allowing TI to manufacture and sell the Aeluros Puma AEL1002 XFI to XAUI integrated circuit (IC) as a TI-branded product. The TI TLK10021 will provide a second-sourcing environment for this low-cost, low-power, high-performance enabler for XFP line card applications. (For more information see www.ti.com/sc04116.)
"TI is pleased to provide its broad worldwide customer base with access to this leading 10G solution, thus broadening its product portfolio for the 10GE and 10G Fibre Channel markets," said Martin Izzard, director of the fiber optics and backplane business unit of TI's high-performance analog business. "Aeluros' proven technical success in the performance, power and integration capabilities of 10 Gbps serial link technology made them a natural choice for this strategic engagement."
"We look forward to enabling TI's successful entry into the XFI-to-XAUI market, and fully expect them to extend their track records of market success and impeccable execution," said Richard Egan, President and CEO of Aeluros. "TI's new TLK10021 and Aeluros' Puma AEL1002 provide a complementary solution to Aeluros' Puma AEL1001 XENPAK/X2/XPAK module IC, making 10G solutions more competitive and accelerating adoption in the marketplace."

Unmatched Low Power

The AEL1002/TLK10021 is an integrated 10 Gbps XFI to XAUI IC, with the primary function of bridging between optical modules compliant with the increasingly popular XFP multi-source agreement, and system MAC and ASIC devices featuring the mainstream 3 Gbps XAUI interface. The AEL1002/TLK10021 provides industry leading power consumption of 800 mW through innovative circuit design techniques and a focus on critical system requirements. The XFP multi-source agreement provides an application-agnostic, ultra-compact form factor 10 Gbps optical module solution, occupying as little as one-fifth the space and one-half the power of alternative modules.

Interoperability and Availability

Aeluros and TI have demonstrated interoperability between the AEL1002/TLK10021 and XFP modules from 10 leading optical module suppliers, reducing compatibility concerns for the system designer. The device is sampling today from Aeluros as the Puma AEL1002 and from TI as the TLK10021.