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TI Executive Outlines Advances in Digital Consumer Electronics at COMPUTEX TAIPEI 2005

Jun 1, 2005

TAIPEI, Taiwan (June 1, 2005) - Wireless communications and digital entertainment are the new driving forces in consumer electronics, said Terry Cheng, president of Texas Instruments Incorporated (TI) [NYSE: TXN] Asia. In a keynote address delivered today at COMPUTEX forum - IAFA 2005, Cheng emphasized the key issues and technology trends that have emerged at the heart of this digital revolution.
"TI´s silicon innovation is helping drive the consumer electronics market for home and on-the-go products, such as DLPTM TVs, mobile phones and portable media players," said Cheng. He added that music, video and images are moving to digital platforms, providing consumers with the enhanced quality and unprecedented degree of flexibility and control required to embrace these innovations. He said this will create new end-user experiences, such as playing your favorite online video game via your Internet Protocol TV (IPTV) set top box or watching live digital TV on a 3G handset while waiting to catch a flight.
"The growth and advancement of 3G technology is fueling a number of feature-rich applications, such as digital TV, video, custom ring tones, 3D games and multi-megapixel imaging. By combining these multimedia capabilities and increased wireless connectivity options into mobile phones, consumers will have mobile entertainment at their fingertips," continued Cheng.
Cheng identified wireless market segmentation, emerging global markets, Wi-Fi® and Bluetooth® networking penetration, and mobile digital TV as industry trends that are shaping tomorrow´s wireless market. "Leveraging a broad portfolio of cellular and mobile connectivity technologies, consumer electronics expertise, and cutting-edge manufacturing processes, TI has proven to the market that we are well-positioned to deliver the next generation of portable electronics." 
In his remarks, Cheng also noted that while consumers are embracing today´s innovations, they continue to demand smaller, sleeker, devices with more functionality and longer battery life at a lower cost. TI is meeting these demands with its innovative DRPTM technology, which significantly reduces board space, extends battery life, and makes for a more cost-effective, powerful, versatile mobile phone. 
"At TI, we have a keen eye on the road ahead. By actively developing new DSP solutions, higher performance and more power efficient analog products, and through our sophisticated and integrated DRP technology roadmap, TI is at the center of today's transition to an increasingly digital world."

About Cheng

As president of TI Asia, based in Taipei, Taiwan, Mr. Cheng oversees five manufacturing facilities, one software and IC development center, six field applications engineering centers, and 13 sales and marketing offices in Asia. In this role since 1997, he turned in record profitability and growth for TI, making Asia the largest region in terms of semiconductor revenues. He executed a series of strategic initiatives in Asia, including Taiwan wireless ODM strategy, China joint design centers, and Signal Processing Value-Added Resellers program that fosters innovation in information appliances.


TI will exhibit at booth T203AB in hall 4 (TICC, Taipei International Convention Center) during COMPUTEX TAIPEI, held May 31 - June 4. Key TI executives will be available to provide information on the company and the product groups which are wireless, consumer electronics, broadband and connectivity. In addition to Cheng´s keynote, Dr. Kun-Shan Lin, Vice President of TI Greater China Strategic Business Development, will be speaking at DigiTimes Forum on June 1. His topic will be WLAN-From Technology to Utility.