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TI Introduces Eight-Channel, Ultra-Low-Power, High-Speed ADCs with Serial LVDS Interface

70.5dB SNR, 70 MSPS with Lowest Power Per Channel Versus Competition

Feb 2, 2004

TUCSON, Ariz. (Feb. 2, 2004) - Establishing a new standard for integration, performance and power, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced a family of octal, 10- and 12-bit, high-speed analog-to-digital converters (ADCs) from the company´s Burr-Brown product line. Featuring serial low-voltage differential-signaling (LVDS) outputs and consuming 123mW of power per channel at 65 MSPS (138mW/channel at 70 MSPS), the ADS527x family offers the lowest power of any competitive product. The devices allow high system density in ultrasound, wireless communications, optical networking, instrumentation, test and measurement, and a variety of other multi-channel applications. (See www.ti.com/sc04020.)

"The innovative ADS527x family offers the highest level of integration and performance by providing eight parallel, 12-bit ADCs with 70.5dB SNR at 70 MSPS. By combining this integration with the lowest power per channel of competitive products, the ADS527x will enable higher channel counts and higher performance in applications such as ultrasound, PET scanners and numerous other imaging and communications systems," said Ed Fullman, product marketing manager for TI's high-speed data converter products. "Ultimately, these devices will allow designers to integrate more channels into smaller, more affordable systems - enabling advanced diagnostics in a broader range of environments around the world."
The ADS527x family includes 40, 50, 65 and 70 MSPS (mega samples per second) versions in 12-bit resolution, and 40, 50 and 65 MSPS versions in 10-bit resolution. All products in this family are both pin and serial LVDS compatible, providing a simple upgrade path in both sample rate and resolution.
Serial LVDS greatly simplifies the ADC interface and allows for compatibility between the different family members in terms of speed and resolution. TI's implementation of serialized LVDS offers the user the flexibility to optimize interface power dissipation based on system requirements, and is compatible with Xilinx and Altera programmable devices. Xilinx deserializer source code is available as a free license from Texas Instruments when used with TI data converters.
The ADS527x family is optimized to work with TI´s high-performance TMS320C6000TM DSP platform, which is used in applications ranging from high-resolution medical imaging to third-generation wireless communications infrastructure. In addition, depending on the application requirements, the ADS527x family is optimized for pairing with many of TI´s high-speed op amps to achieve highest performance.
The integration, performance and power of the ADS527x family will allow imaging systems, such as ultrasound, to improve image quality with exceptional 12-bit, 70.5dB SNR performance, reduce power requirements, increase channel density and decrease board space demands.
In wireless communications systems, such as base stations and pico-cells, the ADS527x family will improve system performance by reducing system complexity, handling more voice channels, reducing system form factors, increasing flexibility and lowering operating costs.

Inside the ADS527x Family

The ADS527x family offers exceptional signal-to-noise ratio (SNR) of 70.5dB (60.5dB for the 10-bit family) at 10 MHz input frequency. The devices provide internal references to simplify system design requirements, or can be driven with external references. The ADS527x family operates from a 3.3V supply.

All eight channels share a common sample clock for excellent skew and jitter performance. Individual power down of each ADC channel enables optimized operation. A peak-to-peak differential input range of 2V maintains signal integrity, and a common internal or external voltage reference allows excellent matching between channels.

Availability, Packaging and Pricing

Samples and EVMs (Evaluation Modules) of the ADS527x family are available now (for more information, go to www.ti.com/sc04020), with volume production scheduled for March 2004. The devices are packaged in an 80-lead TQFP.