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Texas Instruments to License Patents from Sendo

Jul 18, 2003

DALLAS (July 18, 2003) - Texas Instruments Inc. (NYSE:TXN) (TI) today announced that the company has entered into a patent licensing agreement with Sendo related to smartphone technology. TI further stated that, as a result of the license agreement, TI will not be changing its prices.
TI and Sendo have worked together to deliver application-rich Sendo smartphones using TI's high-performance, power-efficient OMAPTM processors. Smartphones using TI's OMAP processors and Sendo's technology will enable a broad range of capabilities such as multimedia messaging, interactive gaming, video-on-demand, digital music, high-end graphics and more.