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Teleca and Texas Instruments Extend Talk Time with Low Power Bluetooth® Headset Solution

Jun 17, 2004

DALLAS and STOCKHOLM (June 17, 2003) - Teleca and Texas Instruments Incorporated (TI) [NYSE: TXN] today unveiled a new Bluetooth® headset solution that enables manufacturers to bring small, highly competitive wireless headsets to market quickly.
The reference design increases wireless device battery life more than two times and is extremely cost effective. Available to manufacturers today, the solution is based on TI's single-chip Bluetooth solution and Teleca's embedded Bluetooth Stack and has passed all internal qualification tests.
"To ensure mass adoption of Bluetooth headsets, manufacturers and solution providers must deliver small, inexpensive, power efficient, differentiated products with short lead time," said Jorgen Simonsson, marketing director, Teleca Systems. "TI's power-efficient single-chip Bluetooth solution allowed Teleca to design a Bluetooth headset solution that addresses reduced price, size and power consumption."
"We designed our Bluetooth chip to meet the unique needs of wireless device manufacturers, which also makes it ideally suited for the Bluetooth headset market," said Ariel Moshkovitz, worldwide marketing manager, TI Short Distance Wireless. "Teleca's technical expertise and ability to take specific customer needs to an end product, and TI's ability to deliver the lowest-power single-chip Bluetooth solution, means significant reductions to size and cost for manufacturers looking for a highly differentiated, easy-to-manufacture product."
The BRF6100 single-chip Bluetooth solution leverages TI's patented digital radio frequency (RF) technology and 0.13u process to achieve significant reductions to size, cost and power consumption. Creating an efficient one-stop shop from reference design to industrialization, the Bluetooth headset solution also includes Teleca's small footprint Bluetooth stack.
Teleca (booth 710) and TI (booth 221) are both demonstrating the headset reference design this week at Bluetooth World Congress in Amsterdam, June 17th-19th.
More information is available at www.ti.com/bluetooth  and at www.teleca.com.