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Taiyo Yuden Introduces Lowest Power Consumption Bluetooth® Module Based on Power Efficient Chip from Texas Instruments

Module Offers Complete, Low Cost Bluetooth Hardware Solution for Mobile Devices

Jun 16, 2003

DALLAS and TOKYO (June 17, 2003) - Taiyo Yuden Co. Ltd., a forerunner in the field of Bluetooth® module development, today launched its newest Bluetooth module for mobile devices, which is based on the single-chip Bluetooth solution from Texas Instruments Incorporated (TI) [NYSE: TXN]. The module includes all necessary external components, consumes up to 40 percent less power than competitive products and is extremely small.
"Our newest module is the result of the synergistic collaboration with TI," said Dr. Yukihiro Kawada, senior operating officer of Taiyo Yuden. "We are delighted to be able to offer a simple, easy-to-implement Bluetooth solution for mobile terminal manufacturers that will barely impact the power consumption of their devices."
Ideal for mobile device manufacturers wanting to quickly and easily add Bluetooth functionality, the module is based on TI´s BRF6100 single-chip solution - the first and only Bluetooth chip to use digital radio frequency (RF) technology. Leveraging TI´s patented digital RF, the BRF6100 is the industry´s smallest, most power efficient and least expensive Bluetooth solution. (For more information on TI´s BRF6100, see www.ti.com/bluetooth.) 
"Working together, Taiyo Yuden and TI developed a highly compelling Bluetooth module that will help enable mass adoption of Bluetooth technology in cellular," said Ari Rauch, general manager of TI Short Distance Wireless. "This product brings us one step closer to TI's goal of making Bluetooth ubiquitous in mobile phones, PDAs and other cellular devices."
The module, which is only 8.4 mm x 8.4 mm x 1.4 mm, has passed all internal qualification tests. It also integrates seamlessly with all TI wireless chipset solutions and OMAPTM application processors, making it compatible with a significant number of mobile devices on the market - today and in the future. (For more information on TI´s wireless portfolio, see www.ti.com/wireless.) 


Taiyo Yuden (booth 513) is demonstrating the new module this week at Bluetooth World Congress in Amsterdam, June 17 - 19. The module is currently sampling and will be available in production quantities in October 2003.