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Alternate Source Agreement Between Texas Instruments and Renesas Technology Solidifies Supply of the Smallest Industry-Standard Logic Package

NanoFree(TM), Pb-free Wafer Chip Scale Package, is Designed for High-Volume Manufacturing Environments for Portable Applications

Jun 10, 2003

DALLAS (June 10, 2003) -- Texas Instruments (TI) (NYSE: TXN), announced today an alternate source agreement for the advanced, Pb-free, logic wafer chip scale package, NanoFreeTM with Renesas Technology Corp. (Renesas), a joint semiconductor venture between Hitachi, Ltd. and Mitsubishi Electric Corporation. This alternate source arrangement increases the availability for LVC single gate technology in the industry´s smallest Pb-free logic package, NanoFree, and provides customers a firm second source for this industry standard package. 

Introduced by TI in 2001, the NanoStarTM/NanoFree package is the logic industry´s smallest package providing a 70% reduction in size over the industry standard SC-70 package. The devices available in NanoStar/NanoFree packaging are the most popular logic functions for space-constrained systems such as wireless handsets, pagers, personal digital assistants, portable DVD players, MP3 players, notebook computers, and other portable consumer electronics. (See www.ti.com/nanostar.)
"Since NanoFree was introduced, TI has seen the adoption rate for this package increase rapidly," said David Hoover, worldwide product marketing manager for TI's Standard Linear and Logic Products. "Our relationship with Renesas confirms a standard for this package, providing customers with a confident second source insuring continued adoption. It was also important that we not only be aligned on the package, but that we provide the same technology for the package."
"This package is the clear standard in the market. Many customers have accepted the NanoFree package due to its space savings value, reliability, and ease of manufacturability," stated Yukiya Kamiya, Department Manager, Multi Purpose Linear & Logic IC Design Dept for Renesas Technology Corp. "Aligning with Texas Instruments on this advanced packaging strategy will provide customers with the industry's premier Pb-free logic package."
With a footprint of 1.40mm by 0.9mm by 0.50mm = 1.26mm2, the 5/6 pin NanoFree package offers a 13 percent reduction in size from any other alternative logic package solution and a 70 percent reduction over the SC-70 Little Logic package. Designers will also realize improved thermal performance with the NanoFree package over the SC-70. This improved thermal performance benefits designers concerned with heat dissipation which is common in portable electronics.
The NanoFree package makes use of SnAgCu (Tin Silver Copper) ball alloy and is classified per J-STD-020B (max reflow temp of 250°C) Pb-free parameters, however, this package reaches a max reflow of 260°C. With a ball pitch of 0.5mm, these self-planarizing balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.

Availability and Pricing

Texas Instruments currently offers single, dual, and triple gate Little Logic functions in LVC and AUC technologies utilizing the NanoFree package. Renesas will offer single, dual, and triple gate LVC technology in the Pb-free wafer chip scale package, NanoFree. The NanoFree packaging is fully supported with technical documentation including a WCSP Design Summary and Little Logic Selection Guide located on-line at www.ti.com/nanostar.

As initial NanoFree products, Renesas, has developed the HD74LVC1G series of high-speed, low-voltage Unilogic ICs sharing the specifications of TI's SN74LVC1G series high-speed, low-voltage Little Logic NanoFree products. Initially, sample shipments of two models, the HD74LVC1G04 and HD74LVC1G97, will begin in Japan in June 2003.