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Texas Instruments to demonstrate SuperSpeed USB hub technology at the Intel Developer Forum 2009, San Francisco

Sep 23, 2009

WHAT:     Intel Developer Forum (IDF) San Francisco

Texas Instruments Incorporated (TI) will perform a public demonstration of SuperSpeed USB hub technology during the Intel Developer Forum, September 22 – 24 in San Francisco. Visit TI booth #725 to learn how TI continues to develop SuperSpeed USB solutions.

Attendees will have the opportunity to view how true SuperSpeed USB capability works in both a SuperSpeed USB hub (TUSB8040), a peripheral SuperSpeed USB to SATA 3Gig bridge (TUSB9260), and a SuperSpeed USB transceiver (TUSB1310) to meet demands for a variety of applications and end-equipment such as PCs and PC peripherals for imaging, instrumentation and test equipment.

TI devices work with the Synopsys DesignWare SuperSpeed USB digital controller intellectual property (IP) to speed time-to-market for these products. Additionally, TI will demonstrate interoperability using the xHCI host from NEC Microelectronics.

Samples for the TUSB1310 and the TUSB9260 will be available in 4Q09, and they will be in volume production in 1Q and 2Q 2010, respectively. Samples for the TUSB8040 will be available in 2Q10. 

WHEN:    September 22 – 24, 2009

WHERE:     Intel Developers Forum
                 Moscone West Convention Center
                 747 Howard Street, San Francisco, CA  94103
                 Texas Instruments Booth #725

Find out more about TI’s interface products by visiting these links:

  • Learn about SuperSpeed USB technology: www.ti.com/usb-pr
  • Download TI’s Interface Selection Guide: www.ti.com/interface-pr.
  • Ask questions and share knowledge in TI’s E2E online design community: http://www.ti.com/e2e-pr.
  • Follow TI on Twitter: www.twitter.com/txinstruments.


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