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For multimedia infrastructure applications, Texas Instruments' multicore TMS320C6678 DSP delivers increased density, low power, cost efficient solution

Industry's highest performing 10-GHz multicore DSP delivers 3x the channel density for multimedia gateways and IMS media servers

Feb 10, 2011

DALLAS, Feb. 10, 2011 /PRNewswire/ -- Responding to the growing need for increasing channel densities and higher quality media services in mobile networks, Texas Instruments Incorporated (TI) (NYSE: TXN) is offering the industry's highest performance multimedia solution based on its TMS320C6678 digital signal processor (DSP). Ideal for applications such as multimedia gateways, IMS media servers, video conferencing servers and video broadcast equipment, the C6678 offers OEMs a highly dense media solution that is both power and cost efficient at the system level. Based on its newest DSP generation of devices, the TMS320C66x, TI's C6678 features eight 1.25 GHz DSP cores with 320 GMACs and 160 GFLOPs of combined fixed- and floating-point performance on a single device, enabling users to consolidate multiple DSPs to save board space and cost, as well as reduce overall power requirements.

"There is no other DSP in the industry that can support all of the key features needed for the development of high density and high quality multimedia infrastructure products in one device, like ours," said Brian Glinsman, general manager of TI's communications infrastructure business. "Our C6678 based multimedia solution delivers superior levels of performance coupled with improved channel density, providing customers with the right tools, software and support to help accelerate their designs to market."  

To ease application development, TI's new multimedia solution includes a comprehensive portfolio of video, audio and voice codecs, which will be accessible through TI's website. The available portfolio of video codecs includes the H.264, H.263, MPEG4, MPEG2, JPEG, VC1, Soren Spark encoders and decoders. New codecs and functions including Universal SVC, MVC, AVC Intra and H.265 are also supported on the C6678 DSP. The portfolio of audio codecs includes the AAC, AACv2, AC3, MP3, WMA8, WMA9 encoders and decoders. The codec portfolio also includes a comprehensive set of wireline and wireless voice codecs.

Combined with the multicore software developer's kit (MC-SDK), suite of multicore tools, free codecs and a rich ecosystem of software and hardware partners, the power of TI's multicore DSP enables customers to develop new multimedia infrastructure products that offer greater channel densities, at lower power levels and more cost efficiently. The C6678 is also software compatible with TI's existing TMS320C6000 DSPs, enabling vendors to reuse their existing software and preserve their investment in TI embedded processors.

The C6678 enables high density solutions for numerous multimedia applications, such as:

Multimedia Application

System Solution Density (# of channels)

PCIe card – 8 C6678 DSP

ATCA card – 20 C6678 DSP

Mobile Voice Applications
AMR Encode + Decode, 12.2Kbps



Mobile Video Applications
H.264 BP encode + decode, CIF, 30fps



Content Delivery Network
H.264 BP Encode + Decode, SD, 30fps



HD Conferencing MCU, MRFP
H.264 BP Encode + Decode, 1080p30



HD Broadcast
AVCIntra-50, 10-bit, 4:2:0, 60fps



Robust third-party ecosystem

TI's multimedia third party network features a worldwide community of respected and well established companies offering products and services that support TI DSPs. Companies offering supporting multimedia solutions to the C6678 multicore DSP include:



Designers can begin development on the C6678 DSP with the low-cost TMDXEVM6678L evaluation module (EVM) for $399. The EVM also includes a free MC-SDK, Code Composer Studio (CCS) integrated development environment, and suite of application/demo codes to allow programmers to quickly come up to speed on the new platform. Pricing for the C6678 DSP starts at $169 for 1Ku and order entry is open today for both the C6678 and EVM.

TI's comprehensive suite of multimedia codecs and third party ecosystem solutions will be available in March.

TI @ Mobile World Congress

While at MWC, visit TI at Booth 8A84 (Hall 8) to learn more about the latest communications infrastructure, analog, wireless and DLP news, and to check out a broad range of TI-based demos. For more information please visit www.ti.com/mwc2011.

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries.  For more information, go to www.ti.com.


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