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Texas Instruments perpetuates innovation with leading analog, wireless and embedded processing solutions at ESC 2011

Apr 21, 2011

WHAT:          New ultra-low-power, video decode and display and ARM® solutions are just a few of the cutting-edge technologies that Texas Instruments Incorporated (TI) will showcase at booth #1530 during the Embedded Systems Conference (ESC), Silicon Valley in San Jose, Calif. TI experts will lead discussions on a range of topics, including migration of software onto multicore digital signal processors (DSPs), intelligent input/output processing for DSP + ARM processors and how embedded developers utilize analog power devices.

TI will also give away hundreds of development kits as part of its “Tool Swap” microcontroller (MCU) kit exchange program, which encourages attendees to bring in underperforming competitive microcontroller hardware tools and make the switch to TI’s leading solutions. Attendees can get more information at www.ti.com/make-the-switch and receive real-time invites to more giveaways via TI’s Facebook and Twitter pages.

While at ESC, visit TI at Multicore Expo to learn more about the latest multicore design challenges and technology trends and register for TI's Tech Days for access to a range of technical design seminars and training exhibits.


WHEN:          May 2-5, 2011

For conference information, please see:



WHERE:       ESC Silicon Valley

McEnery Convention Center

San Jose, Calif.


CONNECT:  Follow TI on Twitter: www.ti.com/twitter

Become a fan of TI on Facebook: www.ti.com/facebook

Engage with engineers and TI experts on the TI E2E™ Community: e2e.ti.com/



Monday, May 2

1:00 p.m.         Tutorial: Analog power in embedded world

Head to this half-day tutorial to learn from TI’s Peter James Miller about how an embedded systems designer uses the capabilities of analog power devices through efficient power supply design.

Location: Room N

Tuesday, May 3

8:00 a.m.         Presentation: Memory power – Power solutions for DDR and stub logic

In this presentation, TI expert Peter James Miller solves the problem of powering DDR memory and stub logic systems, providing tips and examples to determine the amount of power needed to meet application requirements.

Location: Room N

3:15 p.m.         Presentation: Middleware/firmware design challenges due to dynamic raw NAND market

TI’s Daniel Allred will discuss the difficulties associated with developing and maintaining firmware, middleware and hardware IPs when interfacing with a dynamic raw NAND market and explain how to mitigate these challenges.

Location: Room N

4:00 p.m.         Session: Unleash the power of Stellaris® with open source based tools from CodeSourcery

Join Mentor Graphics’ Mark Mitchell to hear about how to easily develop Stellaris ARM Cortex™-M MCUs using CodeSourcery’s G++ environment.

Location: Room K

Thursday, May 5

2:00 p.m.         Presentation: Using IBIS to ease your life

Come listen as TI expert Bonnie Baker examines the numerous ways Input-Output Buffer Information Specification (IBIS) can ease your life, solving many board-level, signal integrity issues during hardware design and troubleshooting.

Location: Room J4

3:15 p.m.         Presentation: Intelligent I/O processing for DSP + ARM processors

Join TI’s Loc Truong as he explain how DSP and ARM cores as well as operating systems (OSes) can be used to boost system-level throughput in a DSP + ARM system-on-chip (SoC).

Location: Room J4

4:30 p.m.         Presentation: Power management in embedded systems with multiple OSes

Come listen as Loc Truong explains new power management features relevant to various OSes as well as how inter-processor communication and state machine design can reduce system power on a heterogeneous multicore system.

Location: Room F1/F2



ARM microprocessors: Experience the full functionality of the ARM processor on the AM389x Sitara™ ARM evaluation module (EVM), running up to 1.5 GHz to drive multiple HD and SD displays simultaneously.

Digital media processors: Check out a range of digital media capabilities, including remote media display (RMD) on the DM368 DaVinci™ digital media processor and HD video decoding on the DM816x DaVinci digital media processor.

Digital signal processors: Learn about a variety of embedded tools that help developers get started on TI’s DSP + ARM and DSP processors, and try out our application-specific demos on the C6-Integra™ DSP + ARM platform. 

Microcontrollers: Experience the latest from TI’s ultra-low power MSP430™, ARM Cortex™-M Stellaris and real-time control C2000™ MCUs with featured demos on industry-first technology, capacitive touch, digital LED control, wireless connectivity and more.

Multicore: Check out an exciting medical imaging demo on TI’s multicore DSPs. 

Wireless: Check out TI’s latest wireless connectivity advancements such as demos running on a GPS platform and a MCU + Bluetooth® technology platform as well as exciting end equipments.

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Stellaris is a registered trademark, and MSP430, C2000, C6-Integra, DaVinci and Sitara are trademarks of Texas Instruments. All other registered trademarks and trademarks belong to their respective owners.