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TI to demonstrate innovations for industrial and automotive designs

Visit TI at electronica 2014 - November 11-14 - hall A4, booth 420

Oct 14, 2014

FREISING (Oct. 14, 2014) – At electronica 2014 in Munich, Texas Instruments (TI) will showcase how analog and embedded processing semiconductors enable innovative technologies to meet today’s industrial and automotive challenges. Visitors will have the opportunity to participate in hands-on demonstrations that reveal how the right products and solutions for complex systems can make development easy and shorten development times. Further details on TI’s activities at the tradeshow can be found at electronica2014-pr-eu.

Main highlights of the TI booth include:

·         Industrial: TI’s industrial portfolio offers differentiated hardware and software solutions as well as tools and support to help customers develop innovative products. Key application areas include motor control, programmable logic controllers, sensor transmitters, industrial communication, smart grid, building access control and energy management. At electronica, TI will demonstrate a number of analog and embedded processing solutions, such as an industrial communication demo that shows the implementation of five industrial Ethernet protocols widely used in industrial automation: Profinet IRT, EtherNet/IP™, EtherCAT®, Powerlink and Sercos III. These protocols are implemented as slave configurations on TI’s processors and can be dynamically loaded instantaneously.

·         Automotive: From headlights to taillights and all systems in between, TI offers a wide range of innovative technologies for the state-of-the-art automobile. With solutions in infotainment, critical active and passive safety systems and advanced driver assistance, as well as emerging solutions for hybrid/electric power trains, including many connected by wireless connectivity technology, TI is changing the way the industry thinks of automotive innovation. Among other demonstrations, TI will showcase a DLP® head-up display that enables augmented reality with twice the field of view compared to existing solutions.

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