News Room : wireless

Texas Instruments unveils industry's first 12-bit, 1-GSPS ADC with buffered input, simplifying analog front-end design in wide-bandwidth applications

NewsCenter — Mon, 26 Oct 2009 13:00:00 GMT

Analog-to-digital converter provides twice the sample rate for wireless communications, defense, and test and measurement equipment

PRNewswire

DALLAS

(NYSE:TXN)

DALLAS, Oct. 26 /PRNewswire/ -- Texas Instruments introduced today an analog-to-digital-converter (ADC) that combines 12 bits of resolution with a 1-GSPS sampling rate, effectively doubling the amount of signal bandwidth that can be captured in a single ADC. The ADS5400 offers an unmatched signal-to-noise ratio (SNR) of 59 dBFS and 75 dBc spurious-free dynamic range (SFDR) in first Nyquist, and 58 dBFS SNR and 70 dBc SFDR performance for intermediate frequencies (IFs) beyond 1000 MHz. A fully buffered analog input isolates the onboard sample and hold's internal switching to prevent disturbing the signal source, while providing a high-impedance input. The ADS5400's performance enables designers to create smaller, higher-performance and higher-density wide-bandwidth receivers and digitizers. For product details see www.ti.com/ads5400-pr

"The ADS5400 has enabled our latest modular component, the QuiXilica Atlas-V5 VXS board, to handle 12 GB/s of data and generate a real-time result," comments Andrew Reddig, Tekmicro's president and chief technology officer. "Our launch customers are using the Atlas to create higher performance solutions for critical applications that were unachievable with previous A/D technology."

"Customers can use the ADS5400's ground-breaking combination of resolution, sample rate and bandwidth to significantly enhance applications in defense by improving radar and signal intelligence (SIGINT) capabilities, and can double the capture bandwidth of signals with 12-bit resolution in test and measurement," said Art George, senior vice president of TI's High-Performance Analog business unit.

Developed on TI's high-speed, proprietary BiCom3( )complementary bipolar SiGe technology, the monolithic ADS5400 is specified over the full industrial temperature range (-40 degrees C to 85 degrees C). The BiCom3 technology's silicon-on-insulator (SOI) process makes it well suited for high-temperature and high-radiation environments.

Key features and benefits

Fully buffered, 12-bit, 1-GSPS ADC with 2.1 GHz input bandwidth, for wideband signals in oversampling and undersampling applications with 200 MHz or greater signal bandwidth
Buffered analog input provides constant input impedance across time and frequency and eliminates sample-and-hold kickback, simplifying input matching for passive and active analog front end
The ADS5400's adjustable fine gain, offset and phase ease the interleaving of two or more ADCs to create a multi-GSPS digitizer, or the balancing of two ADCs in an I/Q receiver
Thermally-enhanced, 100-pin TQFP (16 mm x 16 mm footprint) package with exposed thermal pad
User-selectable single- or dual-bus DDR LVDS outputs provide designers flexibility to choose between I/O speed and pin-count
Customers can speed time-to-market with compatible TI devices: THS9000 and THS9001 amplifiers to support input frequencies up to 500 MHz; the CDCE72010 high-performance, low phase noise, and low skew clock; the DAC5682Z dual, 16-bit, 1 GSPS DAC; the TPS727xx and TPS717xx low dropout regulators; and the TMS320C6474 and TMS320C6457 DSPs.

Availability and pricing

The ADS5400 is available now in a 100-pin TQFP package and is priced at $775 in 100-unit quantities. An EVM is available for $1299 and is compatible to TI's TSW1200EVM digital capture card, offering a flexible evaluation environment for ADC analysis.

Find out more about TI's data converters at the links below:

ADS5400 evaluation modules and samples: www.ti.com/ads5400-pr
Ask questions and share knowledge on TI's E2E online community: http://www.ti.com/e2e-pr
System block diagrams
- Radar (http://www.ti.com/radar)
- High Speed Data Acquisition (http://ti.com/hsdataacq)

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com

Trademarks

All registered trademarks and other trademarks belong to their respective owners.

TXN-F

Photo: http://www.newscom.com/cgi-bin/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org
PRN Photo Desk photodesk@prnewswire.com

SOURCE: Texas Instruments Incorporated

Web site: http://www.ti.com/

Texas Instruments introduces industry's most highly integrated, full-duplex IF transceiver for wireless backhaul applications

NewsCenter — Fri, 09 Oct 2009 13:10:00 GMT

PRNewswire

DALLAS

(NYSE:TXN)

DALLAS, Oct. 9 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) introduced today an integrated, high-linearity, low-noise intermediate frequency (IF) transceiver with cross-polarization interference cancellation (XPIC) support. The TRF2443 enables designers to reduce solution cost by 40 percent, power consumption by 30 percent, and space by 40 percent, as compared to discrete implementations. This integration combined with an output third order intercept point (OIP3) of 29.5 dBm and a receiver noise figure (NF) of 4.3 dB ensures superior linearity and sensitivity, making this transceiver well suited for wireless infrastructure backhaul and point-to-point microwave end equipment. For more information on this product, see www.ti.com/trf2443-pr

"Microwave equipment manufacturers are looking for ways to help reduce the capital and operating expenditures of their service provider customers and the highly-integrated TRF2443 can help to meet that requirement," said David Briggs, general manager of TI's Radio products group.

Key features and benefits of the TRF2443

Integration of more than 15 functional blocks enables designers to achieve 40 percent board space savings over discrete implementations. Functional blocks include:
- Programmable baseband amplifiers
- Intermediate Frequency (IF) amplifiers
- Analog and digital variable gain amplifiers
- Quadrature modulator and demodulator
- Programmable baseband low pass filters
- Analog-to-digital converter (ADC) buffers
- XPIC output amplifier and receiver
Transmit (Tx) OIP3 of 29.5 dBm and receive (Rx) third order input intercept point (IIP3)of 9.5 dBm allows for more complicated modulation schemes and increased data throughput
Programmable baseband low-pass filters provide flexibility to handle signals with different bandwidths and help to remove unwanted interferer signals
Integrated Tx/Rx synthesizers eliminate the need for complicated external local oscillator circuitry, simplifying design
Automatic DC offset calibration eases design implementation

The TRF2443 broadband IF transceiver is the latest addition to Texas Instruments' high-performance RF product line for wireless communications, including: TRF3703 quadrature modulator, TRF3710 quadrature demodulator and TRF3761 RF synthesizers. Wireless infrastructure customers can accelerate time-to-market by taking advantage of TI's high-performance signal chain solutions that include market-leading analog-to-digital converters, such as ADS62P25, and digital-to-analog converters, such as DAC5662.

Availability and pricing

The TRF2443 device is available in a 14 mm x 14 mm QFP package and is priced at $24.00 in 1000-unit quantities.

Find out more about TI's high-performance RF products at the links below:

Order TRF2443 evaluation modules and samples: www.ti.com/trf2443-pr
TI's high-performance RF portfolio: www.ti.com/rfsolutions-pr

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.

Trademarks

All registered trademarks and other trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

Photo: http://www.newscom.com/cgi-bin/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org
PRN Photo Desk photodesk@prnewswire.com

SOURCE: Texas Instruments Incorporated

Web site: http://www.ti.com/

New OMAP-DM5x coprocessors from Texas Instruments bring 20-megapixel imaging and 720p high-definition camcorder capabilities to mobile phones

NewsCenter — Tue, 06 Oct 2009 13:00:00 GMT

PRNewswire

DALLAS

(NYSE:TXN)

DALLAS, Oct. 6 /PRNewswire/ -- Further addressing consumer expectations for mobile phones that deliver performance equivalent to stand-alone consumer devices, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced two new members of its OMAP-DM5x family of coprocessors, which deliver the industry's highest megapixel (MP) capability, with up to 20 MP still imaging capabilities, as well as 720p high-definition (HD) camcorder functionality. The OMAP-DM515 and OMAP-DM525 coprocessors accelerate imaging and video performance, giving handset manufacturers an easy way to upgrade existing handset designs to get to market quickly with cutting-edge multimedia capabilities. For more information, please visit www.ti.com/omapdmpr.

Key features and benefits of the OMAP-DM5x coprocessor family:

Digital SLR-"like" imaging:
- Industry's highest MP support, with up to 20 MP capabilities and high-quality 720p HD video capture
- 8MP shot-to-shot performance, with 1.4 frames per second in high-quality mode and 2 frames per second in burst mode
Integrated software that delivers stand-alone consumer electronics quality imaging and video:
- Perfect moment technology: Captures a series of shots, allowing users to select the best image in a series
- Smart lighting: Compensates for backlit and low-light environments
- Face tracking: Identifies, recognizes and focuses on faces
- Auto scene detector: Determines appropriate settings based on environment
- Video noise filter: Improves video quality
- Advanced motion-triggered image stability
TV-out capabilities enable content sharing on larger screens
Pin compatibility between all devices allows for easy design upgrades to match changing consumer demands
Eliminates need for external memory
Works with a variety of mobile baseband and application processor solutions, as well as any high-level or real-time operating system.

    OMAP-DM515 and OMAP-DM525 coprocessor specifications

                          Megapixel  (MP)          Video resolution

    OMAP-DM515                 12MP               DVD quality to 720p
     coprocessor                                     HD camcorder
    OMAP-DM525                 20MP               DVD quality to 720p
     coprocessor                                     HD camcorder

To learn more about the OMAP-DM5x coprocessor family, please visit:

Videos: www.ti.com/omapdmvideopr
Images: www.ti.com/omapdmgraphicpr
Block diagrams: www.ti.com/omapdmdiagrampr
Follow TI on Twitter: www.twitter.com/txinstruments
TI Mobile Momentum blog: https://community.ti.com/blogs/mobilemomentum

Availability

The OMAP-DM515 coprocessor is available today. The OMAP-DM525 coprocessor is sampling today, with production expected in 2010. These products are intended for high-volume wireless OEMs and ODMs and are not available through distributors.

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 25 countries. For more information, go to www.ti.com.

Trademarks

OMAP is a trademark of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.

www.ti.com/wireless

SOURCE Texas Instruments Incorporated

Photo: http://www.newscom.com/cgi-bin/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org
PRN Photo Desk photodesk@prnewswire.com

SOURCE: Texas Instruments Incorporated

Web site: http://www.ti.com/

Texas Instruments OMAP™ 3 hardware reference platform to increase open source innovation on the Symbian platform

NewsCenter — Wed, 01 Apr 2009 13:00:00 GMT

LAS VEGAS (April 1, 2009) - Symbian Foundation today announced the Zoom OMAP34x-II mobile development platform (MDP) based on OMAP^TM technology from Texas Instruments (TI) (NYSE: TXN) as the first standard hardware development platform for developers that will help drive open source innovation on the Symbian platform.

The Symbian Foundation together with its ecosystem is creating the most proven, open and complete mobile software platform which is based on Symbian OS^TM and contributed software assets from S60 and MOAP(s). Symbian OS is the leading open mobile operating system that has shipped in over 250 million mobile devices to date.

The foundation plans to move the platform to open source over the next two years, with the intent to use the Eclipse Public License. This will make the platform code available to all for free, bringing additional innovation and engaging an even broader community in future developments. As part of the development of the platform, the foundation is fostering a community of developers, hardware manufacturers and other partners.

Using the Zoom OMAP34x-II MDP, Symbian developers will be able to quickly and easily validate smartphone and Mobile Internet Device (MID) applications that will run on Symbian^3 - the next release of the Symbian platform and is targeted for development in 2H 2009.

The Zoom OMAP34x-II MDP is a feature-rich, battery operated handheld development platform that gives developers the key capabilities to quickly begin developing on the Symbian platform and to reduce time to market for mobile devices.

"TI has a long history of supporting Symbian OS and we're excited about our continuing partnership with the Symbian Foundation," said Pierre Garnier, vice president and general manager in TI's wireless business. "The OMAP 3 software development platform and the Zoom OMAP34x-II MDP make it easy for the Symbian developer community to take advantage of TI's fully featured, affordable hardware platform, sparking innovation and helping developers mastermind the next generation of technologies that shape future mobile consumer experiences."

"Texas Instruments' easy and affordable application development platform will help bring new Symbian open source applications to market more easily and quickly," said Lee Williams, executive director, Symbian Foundation. "The high-performance Zoom OMAP34x-II MDP will also help lower the barriers for innovation and foster new opportunities for the Symbian community."

Key features of the OMAP34x-II MDP include:

4.1" WVGA multi-touch display with a QWERTY keypad in a landscape, form factor
High-performance, low-power OMAP3430 applications processor that supports up to 720p HD video encode/decode, life-like 3D graphics and PC-like performance
Wireless connectivity technology from TI, including WiLink^TM 6.0 (WL1271), a single chip with Wi-Fi®, Bluetooth® and FM functionality; and NaviLink^TM GPS functionality
8-megapixel camera sensor
Capacitive touch display technology supporting a range of multi-touch displays

To learn more about the Symbian Foundation, visit: http://blog.symbian.org/ or www.symbian.org

The Zoom OMAP34x-II MDP is available for ordering. For more information visit: www.ti.com/zoom2forsymbian.

Adobe and Texas Instruments Bring Flash and AIR to OMAP™ Platform

NewsCenter — Wed, 01 Apr 2009 11:00:00 GMT

Collaboration to bring uncompromised web browsing and rich Internet applications to OMAP processor-based devices; Texas Instruments participates in Open Screen Project

LAS VEGAS (April 1, 2009) - At the CTIA Wireless conference, Adobe Systems Incorporated (Nasdaq:ADBE) and Texas Instruments Incorporated (TI) (NYSE: TXN) today announced a technology collaboration to optimize Adobe® Flash® Player and Adobe AIR®, two key components of the Adobe Flash Platform, for the TI OMAP^TM mobile applications platform. TI's collaboration with Adobe will allow manufacturers and developers to fully leverage the benefits of the OMAP platform to reduce time to market while increasing performance and reducing power on devices. A pre-release of the optimized Adobe Flash Player 10 for devices is expected to be available to manufacturers this summer with an official production release expected in Q1 2010. OMAP solutions supporting the pre-release of Adobe Flash Player are expected to be available for manufacturers and developers in the second half of 2009.

This engagement furthers TI's long standing commitment to supporting Flash technology and will make it easier for manufacturers to enable uncompromised web browsing on their devices. It also lets them quickly update and run Flash technology based third-party content and applications while reducing time to market on smartphones, mobile Internet devices (MIDs) and other mobile computing devices. TI will also provide Adobe Flash technology support on the Zoom^TM OMAP34x-II Mobile Development Platform (MDP), with future support for additional planned OMAP processor-based reference platforms, allowing developers to create rich, Flash technology based content that enhances the overall user experience for a variety of markets. By optimizing Flash technology for the OMAP solution, manufacturers and developers can fully exploit offerings of the platform when accessing content developed with Flash technology. For example, leveraging the OMAP platform's hardware acceleration capabilities allows for improved video and graphics performance at lower power.

"Adobe Flash is the leading platform for rich applications, content, and video on the web today and this collaboration is an important step towards bringing web content and complete Internet experiences to mobile devices," said David Wadhwani, general manager and vice president, Platform Business Unit at Adobe. "Mobile users expect to access their favorite content anywhere, at any time, and much of that content is based on Adobe Flash technology. The work with TI on the OMAP platform and the Zoom OMAP34x-II MDP will help deliver these rich experiences to a new range of devices, including smartphones and MIDs, worldwide."

"Archos has always led the way in providing an uncompromised web browsing experience on its Internet Media Tablets," said Henri Crohas, CEO and founder of Archos. "As Flash based videos and content keep on dominating the web, Archos will support again the latest Adobe Flash technology on its 2009 devices, leveraging TI's OMAP platform."

"TI has a long standing history of shipping devices with Flash technology and we are pleased to incorporate Adobe Flash Player 10 for devices and Adobe AIR into our portfolio, enabling our customers to deliver a desktop-compatible Internet browsing experience on the OMAP platform," said Remi El-Ouazzane, vice president and general manager for TI's OMAP Platform Business Unit. "The collaboration allows our customers and partners to advance the user experience, expanding the accessibility of Flash technology from the PC to the mobile environment. This ability will open the door for the creation of new smartphone, MID and other OMAP processor-based devices that deliver full Internet browsing functionality without sacrificing power consumption, performance or cost."

As an innovator of hardware, software and power management technology for smartphones, MIDs, and other consumer technologies, TI also participates in the Open Screen Project, a broad industry initiative to deliver a consistent runtime environment across devices. Announced in May 2008, the initiative is dedicated to enabling web content, standalone applications and uncompromised web browsing across televisions, desktops, mobile devices and other consumer electronics that take advantage of capabilities of the Adobe Flash Platform, including Adobe Flash Player and AIR. For more information, visit www.openscreenproject.org.

About Flash Platform

The Adobe Flash Platform is a complete system of integrated tools, frameworks, clients and servers for the development of web applications, content and video that runs consistently across operating systems and devices. Adobe AIR, which enables developers to use proven web technologies to build applications that extend outside the browser, and Adobe Flash Player are key components of the Adobe Flash Platform. Adobe Flash Player content reaches over 98 percent of Internet-enabled desktops, and Adobe Flash technology is the number one platform for video on the web. In addition, the mobile runtime has shipped and delivered Flash technology based content on close to 40 percent of all new mobile phones and devices in 2008. For more information about the Adobe Flash Platform visit www.adobe.com/flashplatform.

Sensys Networks wireless sensors based on TI microcontrollers help manage traffic for 10+ years without maintenance

NewsCenter — Tue, 17 Mar 2009 09:00:00 GMT

Sensys Networks leverages TI's ultra-low power MSP430 MCUs and RF transceiver to enable smart transportation technology that reduces traffic congestion and emissions

DALLAS (March 17, 2009) - State and municipal agencies that face increasing traffic, pollution and fuel costs are turning to smart transportation technologies to solve their problems. Leveraging ultra-low power microcontroller (MCU) and RF technologies from Texas Instruments Incorporated (TI) (NYSE: TXN), Sensys Networks' Wireless Vehicle Detection System has emerged as a leading traffic management solution because it operates accurately and reliably in harsh conditions for more than 10 years. The Sensys system combines state-of-the-art magnetic sensors with advanced packet radio technology, providing a cost-effective, dependable solution for a wide range of traffic management applications. For more information, please visit www.ti.com/msp430, www.ti.com/lprf and www.sensysnetworks.com.

The Sensys wireless sensors are based on TI's MSP430F14x and MSP430F16x MCUs that run at ultra-low power levels to ensure maximum life of the system, drastically reducing maintenance effort and cost. The data from the sensors is transmitted real-time to a nearby location via TI's CC2430 RF transceiver, and is then transmitted to a local traffic controller or off-site traffic management system.

Key features and benefits of using TI's MSP430 MCUs and RF transceiver:

MSP430 MCUs ultra-low power consumption (<1us clock startup and <50nA pin leakage) enables 10+ year battery life
Intelligent digital and analog peripherals integrated into MSP430 MCUs provide high performance, even during RF transmissions, and consume no power when not in operation
16-bit RISC CPU architecture of the MSP430 MCU enables more effective processing, smaller size and high code density to maximize performance while minimizing memory and power requirement
CC2430 RF transceivers are the world's first IEEE 802.15.4 system-on-chip solution and operate in the 2.4-GHz range, making them ideally suited for reliable, low power digital wireless applications
TI's scalable MCU portfolio consists of hundreds of devices that meet varying price, performance and ultra-low power requirements

"Helping us to extend the life of our product well beyond that of our competitors, we chose TI's MSP430 MCU for its ultra low power capability," said Robert Kavaler, senior VP at Sensys Networks. "With TI's MCU and RF transceiver technology, we're able to offer the leading traffic management solution in the market."

Pricing and availability

The Sensys Networks systems have been deployed around the world in more than 30 U.S. states and 20 countries. The System is available for purchase through Sensys Networks directly or their worldwide distribution network. For more information on the Sensys Wireless Vehicle Detection System, please visit www.sensysnetworks.com.

Find out more about TI's MCUs, RF transceivers and MCU tools by visiting the links below:

TI MSP430 - www.ti.com/msp430
MSP430 tools page - www.ti.com/msp430tools
TI's microcontrollers - www.ti.com/mcu
TI's low power RF - www.ti.com/lprf
MCU tools videos - http://community.ti.com/media/g/microcontrollers/default.aspx
TI E2E MCU community - https://community.ti.com/forums/35.aspx
TI eStore - www.ti.com/estore
TI energy blog - http://TInergy.ti.com
Follow TI on Twitter - www.twitter.com/txinstruments

Texas Instruments extends OMAP™ 3 family with 45 nm products to address a broad range of mobile performance needs

NewsCenter — Mon, 16 Feb 2009 11:00:00 GMT

Advanced 45 nm CMOS process technology dramatically boosts performance while reducing power consumption in Smartphones and Mobile Internet Devices

BARCELONA (February 16, 2009) - To answer handset manufacturers' diverse requirements in the rapidly-evolving Smartphone and Mobile Internet Device (MID) markets, Texas Instruments Incorporated (TI) (NYSE: TXN) announced today that it has extended its popular OMAP^TM 3 family with new 45 nanometer (nm) products. The new OMAP36x application processor family allows mobile device manufacturers to reuse their software investment in TI's popular 65 nm OMAP34x processor family and deliver higher performance computing with lower power consumption. The OMAP36x family of products will offer a range of performance levels, including speeds up to 1GHz, to address increased high performance needs of the MID market all while delivering the low power consumption required by these battery-powered products. The migration to 45 nm technology will also deliver more affordable solutions for mainstream Smartphones. (Visit www.ti.com/omap36x for more information.)

Features and benefits of OMAP36x family:

45 nm CMOS process technology delivers higher performance with lower power consumption versus the OMAP34x family, including an approximately 25% reduction in power and 75% improvement in graphics performance.
Robust multi-tasking platform that supports running multiple applications in parallel by simultaneously exercising the CPU, multimedia performance and 2D/3D graphics engines.
Dedicated 2D/3D graphics hardware accelerator, enabling more immersive user interfaces and compelling graphics for applications like realistic 3D gaming.
Smart pixel technology via OpenGL ES 2.0 delivers stunning imaging capabilities through advanced reflection effects and life-like facial features.
Supports multi-standard 720p HD functionality for HD video recording and playback.
Integrated image signal processor (ISP) supporting up to 12 megapixel (MP) imaging for enhanced photographic image quality and fast shot-to-shot camera performance.
Pre-integrated support for mobile connectivity, including TI's current and future combo WiLink^TM Wi-Fi solutions, NaviLink^TM GPS solutions, and BlueLink^TM Bluetooth(r) solutions.

OMAP36x family overview:

Part	Process Node	ARM Cortex-A8 Clock speed	Graphics Acceleration	Video Performance	Imaging Performance (per second)	Availability
OMAP3610	45 nm	720MHz	In software	VGA/DVD	12 MP	Samples in 3Q 2009.
OMAP3620	45 nm	720MHz	Hardware accelerated	VGA/DVD	12 MP	Samples in 3Q 2009.
OMAP3630	45 nm	720MHz	Hardware accelerated	720p HD	12 MP	Samples in 3Q 2009.
OMAP3640	45 nm	1GHz	Hardware accelerated	720p HD	12 MP	Samples in 3Q 2009.

Availability

The OMAP36x family of products is scheduled to sample in the third quarter of 2009. These products are intended for high-volume wireless OEMs and ODMs and are not available through distributors.

To find out more about the OMAP 36x family, visit the links below:

Technical information on the OMAP36x family: www.ti.com/omap36x_technical
Information on TI's 45 nm process technology: www.ti.com/45nm_omap3
OMAP36x family product bulletin: www.ti.com/omap36x_pb

What they're saying about the OMAP 3 platform:

"NEC plans to use TI's OMAP 3 platform for our near-term handset solutions, and we are pleased to see TI continue to invest in this family of products to address a range of performance needs and help us continue to deliver leading-edge, multimedia rich handsets to the market.

TI also makes it easy for us to support popular mobile operating systems like LiMo, further spurring innovative, creating applications to meet the appetites of consumers around the globe," said Mr. Yoshiharu Tamura, Executive General Manager, Mobile Terminals Business Unit, NEC.

New multi-core OMAP™ 4 applications platform from Texas Instruments ushers in a new era of mobile computing performance

NewsCenter — Mon, 16 Feb 2009 11:00:00 GMT

Future-proof, high-performance, low-power platform makes the vision of the mobile tomorrow a reality

BARCELONA (February 16, 2009) - Helping Smartphone and Mobile Internet Device (MID) manufacturers shape the future of the mobile market with innovative devices, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the new OMAP^TM 4 mobile applications platform. The OMAP 4 platform delivers new, stunning, multimedia-rich user experiences such as 1080p video record and playback, 20 megapixel (MP) imaging and approximately a week of audio play time. The new platform provides significant improvements in performance and play time compared to today's most popular Smartphones, with 10x faster Web page loading times, more than 7x higher computing performance, 6x higher video resolution, 10x better graphics performance and 6x longer audio play time. (For more information, visit: www.ti.com/omap4_product_info).

At the heart of the OMAP 4 platform is a powerful system-on-chip that includes the perfect balance of power efficiency and high performance. The OMAP 4 processor balances processing across four main engines: a programmable multimedia engine based on TI's C64x DSP and power-efficient, multi-format hardware accelerators; general-purpose processing based on the dual-core ARM(r) Cortex^TM-A9 MPCore^TM supporting symmetric multiprocessing (SMP) and capable of speeds of more than 1GHz per core; a high-performance programmable graphics engine; and an Image Signal Processor (ISP) for unparalleled video and imaging performance. The OMAP 4 platform also includes a comprehensive software suite, power management technology and other supporting components, providing the foundation necessary to create devices with mobile computing performance at low power.

"For the past decade, TI has focused on providing an optimal balance of high performance and low power consumption in our OMAP product line to address our customers' needs to quickly and easily address new market trends," said Greg Delagi, senior vice president and head of TI's Wireless Business Unit. "The OMAP 4 platform will enable a new class of mobile devices that will redefine the boundaries of Smartphones and MIDs."

The OMAP 4 platform, built in 45-nanometer (nm) process technology, enables mobile device manufacturers to address the expected applications of tomorrow's handsets, while also providing headroom and programmability to support applications that have yet to be imagined. The new platform will support popular leading mobile operating systems and is validated for real-world use cases, taking into account the many elements of the mobile consumer's experience to simplify application creation and help handset manufacturers get to market quickly.

OMAP 4 platform highlights:

Mobile computing performance and advanced multimedia, with extra headroom and flexibility needed to address next-generation applications. The powerful combination of programmability and multi-core performance provides flexibility to support new and emerging applications and standards. The first members of the family are the OMAP4430 and OMAP4440, with features including:
- Four powerful, high-performance processing engines
  - General-purpose processing leveraging the dual-core Cortex-A9 MPCore, supporting SMP
  - Programmable multimedia engine based on TI's C64x DSP and power-efficient, multi-format hardware accelerators
  - POWERVR™ SGX540 graphics engine
  - Dedicated ISP
- Full 1080p multi-standard HD record and playback
  - Digital SLR-like performance with 20 MP imaging
  - 3D user interfaces supporting life-like graphics, intuitive touch screens, large local displays beyond WSXGA and HDMI compatible external displays
  - Industry-leading power management technology, delivering great multimedia performance while maximizing battery life:
    - 10+ hours of 1080p HD video playback, 4+ hours of 1080p HD record
    - 140+ hours of CD quality audio playback
Broadest support for leading mobile operating systems, and a comprehensive software suite that is tested for real world-uses cases, accelerating time to market. The OMAP 4 platform will support Linux variants such as the Android Mobile Platform and LiMo, as well as Symbian OS™ and Microsoft® Windows® Mobile. Additionally, software for the OMAP 4 platform is tested and validated up to the application level, dramatically reducing development time. Further easing the design process, the OMAP 4 platform includes:
- Pre-integrated support for mobile connectivity, including TI's current and future combo WiLink™ Wi-Fi solutions, NaviLink™ GPS solutions, and BlueLink™ Bluetooth® solutions;
- Pre-validated modem interface software to easily connect the OMAP 4 platform to any external modem;
- New companion power and audio management solutions (TWL6030 and TWL6040) specifically designed to address the performance needs of the OMAP 4 platform; and
- Broad portfolio of other hardware solutions optimized for the OMAP 4 platform, including: DLP® Pico projection technology, analog components and other complementary technologies.
Flexible, open platform for innovation, delivering stunning user experiences and breakthrough mobile computing performance. TI's commitment to open source software, development tools and a vast third party network has helped build a large worldwide community of OMAP mobile application developers. As a result of this commitment and robust development tools like the Zoom OMAP Mobile Development Platform, developers will be able to create exciting new user experiences that have yet to be imagined.

Availability

TI's OMAP 4 platform and development tools are expected to sample in the second half of 2009, with production expected by the second half of 2010. These products are intended for high-volume wireless OEMs and ODMs and are not available through distributors.

To find out more about the OMAP 4 platform, visit the links below:

Technical details on the OMAP 4 platform: www.ti.com/omap4_platform
OMAP 4 platform product bulletin: www.ti.com/omap4pb
Videos about the OMAP 4 platform: www.ti.com/omap4videos

What they're saying about the OMAP 4 platform:

"The announcement of the OMAP 4 platform, which utilizes the ARM Cortex-A9 MPCore multicore processor, is significant for the industry as it represents a new era in mobile computing based on Symmetric Multi Processing. This will enable a step change in performance but retain the power envelope required for mobile devices and compatibility with other Cortex family products," said Ian Drew, EVP Marketing, ARM. "Mobile devices powered by Cortex-A9 MPCore multicore processors will delight end users with a more responsive, higher performance user experience and provide an extended battery life they will appreciate."

"TI's OMAP technology has long been renowned for its leading-edge performance and support of new exciting features. Handset manufacturers have often chosen the combination of OMAP technology and Infineon modems when launching new innovative devices," stated WK Tan, Division President, Infineon Wireless Solutions. "We've been pleased with the ease of integration of our modem technology on the OMAP 3 platform to further facilitate customers in this choice and look forward to working with their next generation, OMAP 4 solutions. By integrating our modem, handset OEMs can develop powerful devices with compelling form factors and battery life."

"With the Internet becoming a common factor for communication, entertainment, and computing, the performance of mobile devices is being pushed to new levels. In addition, the lines between existing devices is blurring while new devices and categories are emerging," said Jim McGregor, chief technology strategist, In-Stat. "The OMAP 4 platform offers a flexible architecture grounded in performance with the dual-core ARM Coretex-A9 MPCore and combined with extensive software support, highly flexible I/O interfaces, and high-end multimedia features, such as 1080p HD video and 20MP camera, that can enable these next generation devices."

"TI's OMAP 4 advanced multimedia capabilities combined with InterDigital's HSPA modem makes a very compelling solution for the fast growing smartphone and MID markets," commented Mark Lemmo, Executive Vice President, Business Development for InterDigital. "InterDigital's integration of the compact SlimChip MID Module adds instant wireless connectivity to the superior performance of the OMAP4 platform, enabling a variety of tomorrow's innovative devices."

"Microsoft is excited to see TI advance its OMAP processor technology. The combination of Windows Mobile and the OMAP platform has created much opportunity for the smartphone category in years past, and today the combination of TI's OMAP 3 processor together with Windows Mobile 6.5 is an impressive example of the possibilities we will continue to deliver," said Tom Gibbons, corporate vice president, Microsoft Corp. "We look forward to further cooperation with TI on the OMAP 4 processor family."

"TI has long supported Symbian OS and, as a founding member of the Symbian Foundation, is committed to future innovation for the platform," said Lee Williams, Executive Director, Symbian Foundation. "Today's announcement is a very welcome expansion to the OMAP portfolio, as it provides support for hardware architectures such as SMP, which is crucial to advancing the performance of mobile products and services."

Texas Instruments demonstrates new OMAP™ platform milestones on the Android Mobile Platform

NewsCenter — Mon, 16 Feb 2009 02:00:00 GMT

TI showcases the most advanced functionality on the Android framework leveraging OMAP application processors and connectivity portfolio

BARCELONA, Spain (Feb. 16, 2009) - Texas Instruments Incorporated (TI) (NYSE: TXN) announced today that it is demonstrating the latest Android mobile platform running on the newly announced OMAP 3 mobile development platform in its booth (Hall 8, 8A84) at Mobile World Congress. TI will demonstrate the most advanced features, functionality and performance available on the Android framework. Attendees will experience high-quality video and audio playback which leverages the flexibility of the OMAP^TM platform and integrated WiLink^TM connectivity solutions running on the Android mobile platform. TI is working with the Open Handset Alliance to address future market requirements with platform advancements that enrich the mobile user experience, including high definition (HD) multimedia, enhanced imaging, and 2D/3D hardware-accelerated graphics for Android-based devices. In addition, continuing its dedication to supporting open source, TI has launched new online resources to help OMAP developers further innovate and collaborate on the Android platform.

TI's Mobile World Congress demonstrations on the Zoom OMAP34x-II MDP include:

High-quality multimedia at WVGA resolution to support easy viewing of the latest Web and video content with extended playback time
Enhanced photo capture and viewer, supporting images up to 8 megapixel
High-performance Web browsing with super-fast Web page renderings and quick access utilizing Wi-Fi connectivity (802.11 b/g/n)
Platform support for integrated 3G modems, providing the flexibility for customers to select modem of choice

Continued investments on Android Platform

TI is working with the Open Handset Alliance, to further extend the capabilities of Android, the OMAP processor and TI connectivity solutions to deliver:

High-definition multimedia with support for video/audio record and playback
2D/3D hardware-accelerated graphics support for optimal power and performance
Support for additional connectivity technologies including 802.11n, Bluetooth®, FM receive, FM transmit and GPS
Commercial digital still camera quality image processing made possible with advanced imaging algorithms

For more information

To order a Zoom development platform and to begin developing on Android: www.ti.com/order_a_zoom
To learn about the new resources and work being done on Android: www.ti.com/androidproject.

New full-featured OMAP™ mobile development platform available now for rapid mobile application creation

NewsCenter — Mon, 16 Feb 2009 02:00:00 GMT

Affordable development platform includes multiple connectivity technologies and support for leading mobile operating systems

BARCELONA (February 16, 2009) - Bringing together all the tools needed for mobile application developers to get fresh, innovative applications to market quickly, Texas Instruments Incorporated (TI) (NYSE: TXN) today unveiled an enhanced version of its OMAP^TM 3 processor-based development platform - the Zoom^TM OMAP34x-II Mobile Development Platform (MDP), which is designed, developed, and manufactured by Logic. The robust new platform gives Smartphone and Mobile Internet Device (MID) application developers who are eager to create applications for leading mobile operating systems, such as the Android Mobile Platform, Linux, LiMo, Symbian OS^TM and Microsoft(r) Windows(r) Mobile, a robust handheld form factor with the wireless connectivity technologies, enhanced imaging, video, display technology, software, as well as an optional 3G modem and optional DLP Pico^TM projection technology module that enables big picture experiences in the palm of your hand. The new platform will be demonstrated this week in TI's booth at Mobile World Congress, Hall 8, 8A84. (See www.ti.com/orderzoom for information on how to order.)

Out of the box features of the Zoom OMAP34x-II MDP:

4.1" WVGA multi-touch display with a QWERTY keypad in a landscape, handheld form factor
High performance OMAP3430 applications processor that supports up to 720p HD video encode/decode
Support for popular leading mobile operating systems, including Android Mobile Platform, Linux, LiMo, Symbian OS and Microsoft(r) Windows(r) Mobile
Wireless connectivity technology from TI, including WiLink^TM 6.0 (WL1271), a single chip with Wi-Fi(r), Bluetooth(r) and FM functionality; and NaviLink^TM GPS functionality
8-megapixel camera sensor
Optional 3G modem solution, as well as flexibility to support any third party modem through an extension card
In the future, an optional DLP Pico projection module will be available, taking mobile content from "tiny screen" viewing to a shareable "big screen" format

Benefits of developing on the Zoom OMAP34x-II MDP:

Affordable, fully featured development platform and debugging tools to get to market quickly on Android and other mobile operating systems
Small, portable form factor that replicates a real-world mobile environment
Fully integrated hardware and software, simplifying the development process and enabling fast time to market
Ideal platform for mobile innovation and creating new user experiences, due to the powerful combination of a high-performance OMAP3430 processor, multi-touch display, rich peripheral set and new sensor technology

Pricing, availability, tools and support

The Zoom OMAP34x-II MDP was designed, developed, and manufactured by Logic, a lifecycle management company with more than 10 years experience working with OMAP technology and developer and manufacturer of customized MDP platforms.

The Zoom OMAP34x-II MDP is available with or without a 3G modem and is available for ordering today through Logic-authorized distributors. The optional DLP Pico projection module for the Zoom OMAP34x-II MDP is expected to be available in mid-2009.

Find out more about the Zoom OMAP34x-II MDP and TI's OMAP family by visiting the links below:

Design with Zoom OMAP34x-II MDP: http://www.ti.com/zoom2_community
Zoom OMAP34x-II MDP technical information: www.ti.com/zoom2_technical
Videos of the Zoom OMAP34x-II MDP: www.ti.com/zoom2_video
Order a Zoom OMAP34x-II MDP: www.ti.com/orderzoom

What they're saying about the Zoom OMAP34x-II MDP:

"As a mobile OS vendor, it is critical for ACCESS to have a full-featured hardware platform to develop on," said Didier Diaz, senior vice president of product strategy management, ACCESS CO., LTD. "The OMAP3430-based OMAP Zoom Mobile Development Platform with its built-in multimedia capability, WVGA display and full complement of connectivity options provides an ideal platform for designing state-of-the-art experiences."

"We are pleased to be a wireless modem supplier for TI's advanced Zoom II mobile development platform. Our high performance HSPA modem offers instant mobile broadband connectivity, accelerating the development of compelling new applications," stated Mark Lemmo, Executive Vice President, Business Development for InterDigital. "Available as a 3G modem option, InterDigital's SlimChip MID Module has been pre-integrated with the OMAP34x-II MDP, allowing mobile application developers to fully exploit the rich capabilities of this platform."

"The Zoom OMAP34x-II Mobile Development platform is the most feature-rich development platform that I've worked on, and the great amount of open source code that TI has made available makes it a very interesting target for developers," said Will Brake, Project Manager, HP Imaging Technologies Licensing.

"The Zoom OMAP34x-II Mobile Development Platform will truly deliver a whole new generation of advanced handheld graphics and multimedia capabilities to the market. Take this and combine with TAT's market leading mobile User Interface Framework, TAT Cascades, and the possibilities will become almost infinite. Our close collaboration with TI allows us to push the visual limits of mobile user interfaces going forward, taking UI creativity and innovation to a whole new level", says Charlotta Falvin, CEO, TAT.

"As a Linux Commercialization Partner in the Open Handset Alliance and TI partner, Wind River has worked with Android on a pre-commercial version of the Zoom OMAP34x platform since mid-2008, when we began using it in association with a joint customer," said Jason Whitmire, general manager of Mobile Solutions at Wind River. "Based on our experience, OEMs and application developers will find the Zoom OMAP 34x-II MDP will speed their time to market for advanced Android-based mobile devices."

TI eases design for energy-efficient and energy harvesting applications with expanded 16- and 32-bit MCU tools portfolio

NewsCenter — Mon, 09 Feb 2009 09:00:00 GMT

Three new controlCARD-based C2000&#8482 tools jump-start digital power development while MSP430F5438 Experimenters Kit drives low power/no-power innovation

HOUSTON (Feb. 9, 2009) - Broadening its portfolio of MCU development tools to help designers create energy-efficient and ultra-low power applications quickly and easily, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced three new tools for TMS320C2000&#8482 32-bit real-time microcontrollers (MCU) and one new tool for the 16-bit MSP430F5xx ultra-low power MCU series. Expanding TI's controlCARD offering, the 32-bit C2000&#8482-based Resonant DC/DC Developer's Kit, Renewable Energy Developer's Kit and Peripheral Explorer Development Kit speed development and enhance functionality for energy-efficient, real-time digital power applications such as solar inverters, uninterruptable power supplies (UPS), telecom rectifiers and LED lighting (www.ti.com/f28xkitspr). The MSP430F5438 MCU Experimenter's Kit helps designers to quickly develop with and learn about the new F5xx MCUs, which provide the industry's lowest active power consumption, more memory and leading integration for applications such as energy harvesting, wireless sensing and automatic metering infrastructure (AMI) (www.ti.com/msp430toolspr).

$299 Resonant DC/DC Developer's Kit (TMDRESDCKIT) key features and benefits

TMS320F2808 controlCARD for DC/DC power conversion in UPS, telecom rectifiers and LED lighting applications
Single transformer LLC type digital power EVM with four distinct feedback methods
Lossless current sensing circuit for fault protection and active load for transient response tuning
On-board USB JTAG emulation with connection for external emulator and power supply
32 KB limited Code Composer Studio&#8482 IDE, open source hardware and software
Future plans to support TMX320F28027 (Piccolo&#8482) controlCARD

$349 Renewable Energy Developer's Kit (TMDSENRGYKIT) key features and benefits

F2808 controlCARD for DC/AC power conversion in solar, wind and fuel cell applications
Front end single-phase boost; board designed for single or three-phase output
Battery charging and management; includes relay switch between battery and solar panel
AC line sensing and synchronization to detect if main grid goes down
Voltage and current measurement for maximum power point tracking and anti-islanding
15-20V DC input, 30V AC output; 5V power supply for C2000 MCU and board components
32 KB limited Code Composer Studio IDE, open source hardware and software
Future plans to support TMX320F28027 (Piccolo) controlCARD

$169 Peripheral Explorer Developer's Kit (TMDSPREX28335) board key features and benefits

Excellent teaching tool for new users or students to demo key C2000 peripherals (ePWM, ADC, McBSP, eCAP, CAN, I2C, SPI, GPIO)
F28335 controlCARD included with peripheral explorer baseboard for full board development
5V power supply for powering C2000 MCU and board components
32 KB limited Code Composer Studio IDE, open source hardware, documentation and open source example software

$149 MSP430F5438 Experimenter Kit (MSP-EXP430F5438) key features and benefits

Based on new MSP430F5438 MCU for ultra-low power designs that need enhanced functionality for wireless sensing applications, smart metering and energy harvesting
Socket allows for easy upgrades and quick application changes
Fast low-power-wireless development with support for various TI low power wireless RF evaluation modules, which cover the sub-1GHz and 2.4GHz frequency bands
Multiple input/output options allow for fast system development, including microphone, joystick control, two push buttons, dot matrix LCD, USB connectivity and a 3.5mm headphone jack for audio output
JTAG headers make the device accessible for real-time, in-system programming and debugging
16KB limited Code Composer Essentials IDE, documentation and open source example software

Pricing and availability

The $299 C2000 Resonant DC/DC Developer's Kit, $169 C2000 Peripheral Explorer Developer's Kit and $149 MSP430F5438 Experimenter's Kit are available for order now via the TI e-store (www.ti.com/estore) or authorized distributors. The $349 C2000 Renewable Energy Developer's kit will be available in early March 2009.

Find out more about TI's MCUs and tools by visiting the links below:

C2000 MCU tools: www.ti.com/f28xkitspr
MSP430 MCU tools: www.ti.com/msp430toolspr
TI microcontrollers: www.ti.com/mcu
MCU tools videos: http://community.ti.com/media/g/microcontrollers/default.aspx
TI E2E MCU community: https://community.ti.com/forums/35.aspx
TI eStore: www.ti.com/estore

Solar energy harvesting kit from TI enables permanently-powered wireless sensor networks

NewsCenter — Mon, 19 Jan 2009 08:00:00 GMT

eZ430-RF2500-SEH kit combines Cymbet's EnerChip&#8482 thin-film battery solution with TI's ultra-low power MSP430 MCU and RF technology

DALLAS (Jan. 19, 2009) - As wireless network systems designers look to alternative energy sources, Texas Instruments Incorporated (TI) (NYSE: TXN) announced a solar energy harvesting (SEH) development kit that converts ambient light into power for industrial, transportation, agricultural and commercial applications. The credit card-sized eZ430-RF2500-SEH kit combines Cymbet Corporation's EnerChip&#8482 thin-film battery technology with TI's MSP430 microcontrollers (MCU), CC2500 radio frequency (RF) transceivers and the eZ430-RF2500 development tool. Developers can now build self powered solar-based wireless sensor networks, eliminating system batteries, which cost time and money to periodically replace, especially in remote locations. The $149 eZ430-RF2500-SEH kit is sampling now and is available via the TI e-store or authorized distributors (www.ti.com/ez430-RF2500-SEHpr).

In remote or hard-to access environments, wireless sensors are becoming increasingly integrated and miniaturized. Until now, designers typically powered wireless devices via storage components such as coin cell or AA batteries. However, these storage technologies do not supply the right mix of charging, storage, discharge and physical size characteristics to provide permanent power for wireless devices. Now, the combination of Cymbet's EnerChip batteries with TI's MSP430 MCU and CC2500 RF technology allows energy harvesters to achieve more efficient storage, processing and transmission in both bright and low light environments.

eZ430-RF2500-SEH key features and benefits

A high efficiency solar panel connected through the EnerChip energy harvesting module delivers enough power to run the wireless application even under low ambient light.
Based on Cymbet's EnerChip solid-state lithium thin-film battery technology, which increases conversion efficiencies when storing and starting power in energy harvesting modules.
Cymbet EnerChips are environmentally friendly, rechargeable and so efficient they can send up to 400 transmissions from a single charge when no ambient light is available.
TI's USB-based eZ430-RF2500 tool provides hardware and software to program an MSP430 MCU and low power wireless transceiver on a postage stamp-sized target board.
MSP430 MCU's ultra-low power, fast wake-up time and system-on-chip (SoC) peripheral integration saves board space while enabling maintenance-free, self-powered sensors.
CC2500 RF transceivers operate in the 2.4-GHz range, making them ideally suited for reliable, low-cost digital wireless applications.

Find out more about TI's eZ430-RF2500-SEH demonstration kit by visiting the links below:

eZ430-RF2500-SEH: www.ti.com/ez430-RF2500-SEH
MSP430 tools page: www.ti.com/msp430tools
eZ430-RF2500 development tool: www.ti.com/ez430
Tools videos: https://community.ti.com/media/g/microcontrollers/default.aspx
TI's microcontrollers: www.ti.com/mcu
TI's low power RF: www.ti.com/lprf
TI energy blog: http://TInergy.ti.com
TI E2E Community and support: https://community.ti.com/forums/35.aspx

TI's single-chip MSP430 MCU and low power RF solution advances networking, energy harvesting, security, lighting and metering

NewsCenter — Tue, 11 Nov 2008 11:00:00 GMT

New CC430 platform makes low power RF system design easy

MUNICH (November 11, 2008) - Helping drive mass market adoption of consumer and industrial wireless networking applications, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the new CC430 technology platform - demonstrated for the first time at Electronica in the TI booth in Hall A4.420 - offering the industry's lowest power, single-chip radio-frequency (RF) solution for microcontroller- (MCU) based applications. By reducing system complexity, shrinking package and printed circuit board (PCB) size by up to 50 percent and making RF design easy, the CC430 platform helps advance applications including RF networking, energy harvesting, industrial monitoring and tamper detection, personal wireless networks and automatic metering infrastructure (AMI). For more information, please see: www.ti.com/cc430.

Best of both worlds on a single chip

The unique blend of TI's 16-bit MSP430F5xx MCU and low power RF transceiver draws a low enough current to enable battery-operated wireless networking applications that operate without servicing for ten years or longer, a critical factor for customers in the metering industry. Advanced functionality in a tiny form factor can also power innovative RF sensor networks that report data to a central collection point to analyze information such as smoke in the atmosphere to detect forest fires, moisture or pesticide information in crop fields or even humidity levels in a winery. The power-efficient, flexible CC430 platform will also enable battery-free sensors that use energy harvesting modules that run off of solar power, human body temperature or vibrations for a power source.

"Our energy harvesting microgenerators are based on the simple idea that the vibration of a piece of plant machinery can be transformed into electrical power for sensor systems to send critical performance data over wireless protocols," explains TI customer, Roy Freeland, CEO of Perpetuum. "Sensing applications are limitless, power supplies are not; solutions like the CC430 platform that combine low power and high functionality with the know-how to take the mystery out of RF design help bridge this gap to help usher in a new age of energy solutions."

Smaller is better

The first CC430 devices are monolithic with high integration to allow for a 50 percent reduction in package and PCB space compared to two-chip solutions. Applications that benefit from this integration and size reduction may include smart hospital tracking systems that communicate patient or medical equipment information to a central location, as well as personal area networking between watches, pedometers, chest strap heart rate monitors and PC-based health and fitness analysis programs. Smaller board space and reduced complexity also help shrink the size of heat cost allocators and AMI smart metering systems, which are expected to make up 28 percent of all electric meters by 2013.

An extensive MSP430 MCU peripheral set will be available for CC430-based devices including intelligent, high-performance digital and analog peripherals like a 16-bit ADC and low power comparators that provide high performance – even during RF transmissions - and consume no power when not in operation. These peripherals also speed design by integrating functions such as an integrated Advanced Encryption Standard (AES) accelerator that encrypts and decrypts data sent wirelessly for more secure alarm and industrial monitoring systems. An additional choice for designers will be the on-chip LCD controller, contributing to further cost- and size reductions for LCD based applications.

Making RF solutions easy

The combination of TI's new MSP430F5xx MCU and low power RF transceiver offers a unique low-power/performance mix and high integration along with extensive RF know-how and support. These advancements help break down barriers to RF implementation such as stringent power, performance, size and cost requirements as well as design complexity and ease-of-development issues, helping bring wireless connectivity to a host of products.

TI is taking the mystery out of RF design with RF reference designs, SmartRF Studio software, RF packet sniffer and design notes. Designers will be able to get up and running easily with a CC430 development kit and tools, such as the Code Composer Essentials (CCE) or IAR Integrated Development Environment (IDE). Third-party support, training and university programs, code examples and libraries also facilitate ease of use and shorten time to market.

Additionally, TI's Low-Power RF and microcontroller E2E online communities offer the opportunity to interact directly with engineers and other experts to ask questions, share knowledge, explore ideas and help solve problems. Go to http://community.ti.com to sign-up, subscribe to a forum and start exploring the TI E2E online community today.

Availability and pricing

Initial devices in the CC430 platform will be based on the 16-bit MSP430F5xx MCU and the industry's leading sub-1GHz CC1101 RF transceiver. TI's low power RF transceivers offer leading selectivity and blocking to ensure reliable communications even in noisy environments. F5xx MCUs allow designers to tap into peak execution performance of up to 25 MHz while consuming as low as 160uA/MHz (microamp per megahertz). As the CC430 platform evolves, future devices will leverage the newest TI MSP430 MCU and low power RF technologies.

The CC430 platform is 100 percent instruction set-compatible with other MSP430 platforms such as the MSP430F5xx, making upgrades easy and allowing choices from the entire portfolio for a range of applications. In addition, the CC430 platform will enable code and design reuse with standalone MSP430 MCU and low power RF transceiver solutions. The first CC430 samples will be available in limited quantities in 1Q09 with mass-market sampling and further device introductions scheduled for later in the year. Pricing for initial devices will start at less than $2 in volume.

Texas Instruments further expands support for the Open Handset Alliance and open source community

NewsCenter — Wed, 22 Oct 2008 02:00:00 GMT

TI's Bluetooth&#174 and wireless LAN technologies available in open source enable customers and developers to create complete, innovative Android-based devices

DALLAS and SAN DIEGO, CALIF. (Oct. 22, 2008) - Texas Instruments Incorporated (TI) (NYSE: TXN) today announced that its Bluetooth&#174 and wireless LAN (WLAN) technology software drivers are available for use in the Open Handset Alliance's Android platform. Open access to these technologies simplifies the design process for handset manufacturers and software developers, providing the resources to architect cutting-edge Android-based devices. TI, a long-time supporter of the open source software community, is the first company to provide open source Bluetooth and WLAN software drivers for the Android platform, and is among the first to open WLAN drivers for the mobile industry.

"TI continues to increase its contributions to the open source community, removing barriers and sparking development of a new breed of mobile devices," said Haviv Ilan, general manager, TI's Wireless Business Unit. "Contributing our Bluetooth and WLAN driver source codes to the Open Handset Alliance's Android platform is another step in this initiative."

TI announced support for the Android platform earlier this year with its OMAP&#174 3 applications processors, and is now providing the critical connectivity elements for its BlueLink&#174 Bluetooth and WiLink&#174 WLAN technologies. Pre-integrating the codes into the Android platform gives developers and handset manufacturers a comprehensive set of tools that simplify the innovation process and reduce time to market. Additionally, TI leverages the Apache and BSD-style licenses in support of the Android platform. With these licenses, a broader number of companies will be able to adopt the Android platform and build on top of it without having to expose proprietary technologies. The flexibility offered with these licenses simplifies the development of consumer devices and encourages further adoption of open source software.

Solid history of supporting open source communities

TI remains committed to supporting open platforms and standards. The company joined the Open Handset Alliance as a founding member in 2007, supporting Android development with its OMAP, Bluetooth and WLAN technologies. In addition to the Open Handset Alliance, TI participates in a number of consortiums that further promote open source development, including the BlueZ community that provides support for the core Bluetooth layers and protocols.

Energy harvesting becomes reality with AdaptivEnergy's wireless, remote sensing solution based on TI ultra-low power technology

NewsCenter — Tue, 19 Aug 2008 10:00:00 GMT

Battery free Joule-Thief(TM) technology combined with TI's MSP430 microcontrollers, RF and eZ430-RF2500 development kit provides wide-ranging ambient intelligence

DALLAS (August 19, 2008) - Demonstrating the advantages of energy harvesting and radio frequency (RF) technology for wireless sensing, monitoring or ambient intelligence, AdaptivEnergy has developed a demonstration kit using Joule-Thief^TM technology to harvest energy and power Texas Instruments Incorporated's (TI) (NYSE: TXN) ultra-low power MSP430 microcontroller (MCU) and RF technology to collect data, control the operation of a system or send sensed data to central collection sites. The Joule-Thief energy harvesting device is based on AdaptivEnergy's Ruggedized Laminated Piezo (RLP&#174) technology, which enables compact energy harvesting modules to power applications such as wireless sensors. These wireless sensors could be used to gather ambient intelligence to detect and report critical conditions in factories, automobiles, office buildings, homes and other environments - all without wiring or batteries. For more information, please visit: www.ti.com/msp430.

An emerging market with vast potential

According to Darnell Group, the potential worldwide market for energy harvesting solutions used in wireless sensor systems could reach approximately 164 million units by 2013, a compound annual growth rate of nearly 65 percent. Energy harvesting is an important emerging area of low power technology that can provide energy not only for large-scale needs through wind and solar systems, but also for smaller-scale needs such as sensor networks, utilizing the vibrations inherent in structures, vehicles and machinery to create power, or harvest energy, that can drive sensors while eliminating the need for wires and batteries. For example, Joule-Thief-enabled sensors could harvest energy from the rumbling vibrations created by traffic on a bridge, then send that data from all the wireless sensors on the bridge to a collection point where it would be analyzed to monitor structural soundness.

Energy harvesting made easy and affordable

Supplying power to a network of sensor-transmitters has traditionally required expensive wiring installation or routine battery changes. Gathering data from difficult or dangerous-to-reach locations using wired sensors may be impossible and or even compromise the safety of personnel installing wiring and replacing batteries. Today, however, AdaptivEnergy's Joule-Thief technology makes remote structural and safety monitoring a straightforward and relatively inexpensive process.

Joule-Thief technology combines AdaptivEnergy's unique stressed-biased RLP energy harvesting beam that converts vibrations or movement into usable electric energy. The RLP Smart Energy Beam allows up to ten times more strain to be applied to the piezoceramic than competing piezoelectric energy harvesting devices, creating more converted electric power for system use. In addition to directly sensing movement, the versatile design accepts inputs from external sensing elements that can help detect strain in bridges and high-rise buildings, equipment fatigue in factories, excessive temperatures, the presence of dangerous chemicals, unsafe events in automobiles and a variety of other environmental conditions.

Complementing the RLP Smart Energy Beam and collection electronics is active intelligence and communications based on a chipset consisting of an MSP430F2274 microcontroller and a CC2500 RF transceiver, which allows the Joule-Thief design to gain as much processing and transmission as possible from the charge stored in a capacitor. With leading low power consumption in active and standby modes, the MSP430 microcontroller provides a fast wake-up time of less than a microsecond for a preferable low power/high performance solution. For a demonstration of the Joule-Thief technology and other energy harvesting applications, visit www.ti.com/energyharvesting.

System-on-chip (SoC) integration of peripherals in the MSP430 microcontroller such as analog-to-digital converters (ADC), timers, comparators and a variety of memory configurations helped AdaptivEnergy save space and board costs while enabling them to build a maintenance-free wireless sensor suitable for a wide range of ambient intelligence applications. TI's CC2500 RF transceivers operate in the 2.4-GHz range, making them well-suited for reliable, low-cost digital wireless applications.

Get started fast with Joule-Thief Demo kit and eZ430-RF2500 development tool

AdaptivEnergy offers a Joule-Thief Energy Harvesting Demonstration Kit that includes a RLP Smart Energy Beam along with collection and storage electronics in a matchbox-sized package, allowing developers to easily explore harvesting energy from vibrations. AdaptivEnergy also supplies TI's eZ430-RF2500 microcontroller development tool, which includes all the hardware and software required to develop an entire wireless control network and comes in a USB stick form-factor with an emulator for in-system programming and debugging. Using the Joule-Thief kit and the eZ430-RF2500 microcontroller tool in conjunction, developers have a complete system for designing a low-cost, low power wireless sensor driven by environmental vibrations.

AdaptivEnergy has already engaged with a number of leading system developers who are using the Joule-Thief design to create advanced sensing applications that will begin appearing in the next one to two years. In addition, AdaptivEnergy has entered into a strategic agreement with In-Q-Tel, a company that identifies innovative technology to support the mission of the U.S. intelligence community. For more information on AdaptivEnergy please visit www.adaptivenergy.com.

For more information on the Joule-Thief Energy Harvesting Demonstration Kits please visit adaptivenergy.com/energy_harv/docs/JouleThief_productbrief_20080819.pdf or call (757) 320-1525. Demonstration kits are available for $699.

TI enables innovation with broad range of microcontrollers

From ultra-low power 16-bit microcontrollers in the MSP430 platform to industry standard 32-bit microcontrollers and the high performance TMS320C2000^TM controller platform, TI offers the broadest range of embedded control solutions. Designers can accelerate their designs to market by tapping into TI's complete free software and low cost hardware tools, extensive third-party offerings and technical support. For more information on TI's controllers, see www.ti.com/mcu.