News Room : omap

New OMAP-DM5x coprocessors from Texas Instruments bring 20-megapixel imaging and 720p high-definition camcorder capabilities to mobile phones

NewsCenter — Tue, 06 Oct 2009 13:00:00 GMT

PRNewswire

DALLAS

(NYSE:TXN)

DALLAS, Oct. 6 /PRNewswire/ -- Further addressing consumer expectations for mobile phones that deliver performance equivalent to stand-alone consumer devices, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced two new members of its OMAP-DM5x family of coprocessors, which deliver the industry's highest megapixel (MP) capability, with up to 20 MP still imaging capabilities, as well as 720p high-definition (HD) camcorder functionality. The OMAP-DM515 and OMAP-DM525 coprocessors accelerate imaging and video performance, giving handset manufacturers an easy way to upgrade existing handset designs to get to market quickly with cutting-edge multimedia capabilities. For more information, please visit www.ti.com/omapdmpr.

Key features and benefits of the OMAP-DM5x coprocessor family:

Digital SLR-"like" imaging:
- Industry's highest MP support, with up to 20 MP capabilities and high-quality 720p HD video capture
- 8MP shot-to-shot performance, with 1.4 frames per second in high-quality mode and 2 frames per second in burst mode
Integrated software that delivers stand-alone consumer electronics quality imaging and video:
- Perfect moment technology: Captures a series of shots, allowing users to select the best image in a series
- Smart lighting: Compensates for backlit and low-light environments
- Face tracking: Identifies, recognizes and focuses on faces
- Auto scene detector: Determines appropriate settings based on environment
- Video noise filter: Improves video quality
- Advanced motion-triggered image stability
TV-out capabilities enable content sharing on larger screens
Pin compatibility between all devices allows for easy design upgrades to match changing consumer demands
Eliminates need for external memory
Works with a variety of mobile baseband and application processor solutions, as well as any high-level or real-time operating system.

    OMAP-DM515 and OMAP-DM525 coprocessor specifications

                          Megapixel  (MP)          Video resolution

    OMAP-DM515                 12MP               DVD quality to 720p
     coprocessor                                     HD camcorder
    OMAP-DM525                 20MP               DVD quality to 720p
     coprocessor                                     HD camcorder

To learn more about the OMAP-DM5x coprocessor family, please visit:

Videos: www.ti.com/omapdmvideopr
Images: www.ti.com/omapdmgraphicpr
Block diagrams: www.ti.com/omapdmdiagrampr
Follow TI on Twitter: www.twitter.com/txinstruments
TI Mobile Momentum blog: https://community.ti.com/blogs/mobilemomentum

Availability

The OMAP-DM515 coprocessor is available today. The OMAP-DM525 coprocessor is sampling today, with production expected in 2010. These products are intended for high-volume wireless OEMs and ODMs and are not available through distributors.

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 25 countries. For more information, go to www.ti.com.

Trademarks

OMAP is a trademark of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.

www.ti.com/wireless

SOURCE Texas Instruments Incorporated

Photo: http://www.newscom.com/cgi-bin/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org
PRN Photo Desk photodesk@prnewswire.com

SOURCE: Texas Instruments Incorporated

Web site: http://www.ti.com/

Texas Instruments announces new 720 MHz OMAP3530 processor targeted at multimedia applications

NewsCenter — Tue, 29 Sep 2009 13:00:00 GMT

Speed upgrades on both the ARM® Cortex™-A8 and TMS320C64x+™ DSP give designers more headroom to add features and custom software

PRNewswire

HOUSTON

(NYSE:TXN)

HOUSTON, Sept. 29 /PRNewswire/ -- Giving designers more performance to run new application features and additional headroom to add their own IP, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced a speed upgrade for the OMAP3530 applications processor and evaluation module (EVM). The new OMAP3530 processor features a 720 MHz ARM® Cortex™-A8 core and a 520 MHz TMS320C64x+™ DSP. This enables users to gain faster access to databases, spreadsheets, presentations, e-mail, audio and video attachments, Web browsing and video conferencing applications. This single-chip solution also supports faster boot times suitable for applications such as portable infotainment, Point-of-Sale (POS) devices, Web tablets and single board computers (http://www.ti.com/OMAP3530perf-increase-prprod).

720 MHz OMAP3530 processor key features and benefits:

720 MHz ARM Cortex-A8 core provides 1400 Dhrystone million instructions per second (MIPS)
520 MHz C64x+™ DSP provides more headroom to optimize quality audio and video codecs and custom IP
POWERVR SGX™ subsystem for 3D graphics acceleration to support display and gaming effects
Comprehensive power and clock-management scheme that enables high-performance, low-power operation and low-power standby features
Pin-for-pin compatible with TI's OMAP35x devices makes it easy for OEMs to efficiently create a complete product portfolio based on the single platform

OMAP3530 EVM key features and benefits:

Based on the 720 MHz OMAP3530 processor and can also be used to evaluate the OMAP3503, OMAP3515 and OMAP3525
Ability to run full-featured operating systems, such as Windows® Embedded CE and Linux
New S-Video/Component/Composite input, S-Video output
Features TI's TVP5146 analog-to-digital video decoder
TI integrated power management ICs, OMAP3530 power requirements and design considerations: www.ti.com/omap3530power-pr.

Availability

The OMAP3530 at 720 MHz, available in multiple package size options, as well as the OMAP3530 EVM are now available at www.ti.com/omap35x. In addition to the new 720 MHz devices, developers can continue to take advantage of the OMAP3530 at 600 MHz.

Find out more about TI's OMAP3530 processor and EVM by visiting the links below:

OMAP3530 product folder: http://www.ti.com/OMAP3530perf-increase-prprod
OMAP3530 EVM: http://www.ti.com/OMAP3530perf-increase-prtools
OMAP3530 datasheet: http://www.ti.com/OMAP3530perf-increase-prdatasheet
TI E2E community for OMAP: http://www.ti.com/OMAP3530perf-increase-prcommunity

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.

Trademarks

TMS320C64x+ and C64x+ are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

Photo: http://www.newscom.com/cgi-bin/prnh/20010105/NEF016LOGO
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PRN Photo Desk photodesk@prnewswire.com

SOURCE: Texas Instruments Incorporated

Web site: http://www.ti.com/

Four new processors from Texas Instruments provide unmatched connectivity options and power-efficiency for smarter, greener industrial and communications products

NewsCenter — Mon, 29 Jun 2009 08:00:00 GMT

TMS320C674x and OMAP-L138 feature SATA and universal parallel port (uPP) for high-capacity storage and high-speed data transfer

HOUSTON (June 29, 2009) — Connected, energy-efficient designs require high levels of peripheral integration, lower heat dissipation and longer battery life. To address this, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced four new processors (TMS320C6742, TMS320C6746, TMS320C6748 and OMAP-L138) with unmatched connectivity options and fixed- and floating-point capabilities that are also the industry’s lowest power floating-point digital signal processors (DSPs). For more information, click here.

Packed with a unique combination of application-tuned features and peripherals, these devices reduce overall system cost for a wide spectrum of products including industrial, communications, medical diagnostics and audio. For instance, power protection systems benefit from the OMAP-L138 device’s fixed/floating-point DSP, ARM9, Ethernet MAC (EMAC) and LCD controller for up to $14 cost reduction compared to current solutions. For applications that need high-speed data transfer and high-capacity storage, such as test and measurement, public safety radios, music effects and intelligent occupancy sensors, the processors feature a universal parallel port (uPP) and are also the first TI devices with an integrated Serial Advanced Technology Attachment (SATA).

With performance levels up to 300 MHz, these products offer the ability to manage on-chip power through dynamic voltage and frequency scaling (DVFS) and multiple power down modes. When coupled with TI power management software and complementary analog solutions, developers can optimize their system for performance and power without having to be an energy expert. To ease and reduce development time, the new offerings are pin-for-pin compatible with each other, code compatible with all TMS320C6000™ devices and complemented by a low-cost experimenter board and full-featured evaluation module (EVM).

C6742, C6746 and C6748 DSP key features and benefits:

Lowest-cost and lowest-power C6000™ processors and industry’s lowest-power floating-point DSPs with 7mW of standby power at 1.0V/25°C and 420mW total power in use case scenarios
Standby power up to nine times lower than existing floating-point DSP solutions on market
First TI processor with an integrated SATA for high-capacity data storage
A uPP enables high-speed connection to data converters, FPGAs or other C6742/C6746/C6748/ OMAP-L138 processors
EMAC, multimedia card/secure digital (MMC/SD) and high-speed USB 2.0/1.1 for desktop, network or portable connectivity or storage
Video port interface provides the ability to input/output raw video while a LCD controller allows developers to easily connect video graphics array (VGA) resolution displays
Multiple operating points facilitated through DVFS, powering off unused peripherals and selectable I/O voltages enable portability and reduce heat dissipation in products
Complementary TI TPS65070 power management device implements all sequence and default options as well as supports the devices’ power modes
C674x core up to 300 MHz provides floating-point operations for high-precision and wide dynamic range as well as fixed-point operations for higher performance
Pin-for-pin compatibility (C6742, C6746, C6748 and OMAP-L138) enables customer to expand their entire product portfolio using the same hardware and software platform
128 KB to 448 KB on-chip memory to reduce external memory access and power usage

OMAP-L138 processor features and benefits:

Dual-core processor that builds on the C6748 DSP with a 300 MHz ARM9 gives developers the flexibility to add intuitive human machine interfaces, touch screens or networking capability to their applications
ARM9 allows developers to implement high-level operating systems, such as Linux
Windows® Embedded CE and Integrity® support is expected in 4Q09
Low power usage with 440mW total power and 15mW in standby mode in use case scenarios

Development tools for varying levels of expertise:

A community-supported $149 experimenter board is available from Logic, the designer and manufacturer. The board features the OMAP-L138 system-on-module (SOM), 64 MB mDDR, open source Linux, DSP/BIOS™ drivers and can be used to develop on any of the four devices.
An OMAP-L138/C6748 EVM from TI is available for those that need full peripheral access and TI support. The EVM builds on the experimenter board with an extra C6748 SOM, double the memory (128 MB mDDR) and full support for connectivity peripherals.
An OMAP-L138 (SOM) is a production-ready solution with 128 MB mDDR, power management and Ethernet PHY. It is available for less than $99 @ 10k EAU from Logic (www.logicpd.com).

Pricing and availability

All processors are available for sampling and are priced as follows: TMX320C6742 for $6.70, TMX320C6746 for $13.50, TMX320C6748 for $15.20 and OMAP-L138 for $18.60 (1,000 units).

With an extensive portfolio of low power DSPs, including the lowest standby power DSPs from the C5000 portfolio to the ultra-low power microcontrollers, the lowest power floating-point DSPs and power management solutions in analog, TI continues to lead the market with innovative energy-efficient technology across its entire portfolio.

Find out more about TI’s C674x and OMAP-L138 processors by visiting the links below:

Texas Instruments extends OMAP™ 3 family with 45 nm products to address a broad range of mobile performance needs

NewsCenter — Mon, 16 Feb 2009 11:00:00 GMT

Advanced 45 nm CMOS process technology dramatically boosts performance while reducing power consumption in Smartphones and Mobile Internet Devices

BARCELONA (February 16, 2009) - To answer handset manufacturers' diverse requirements in the rapidly-evolving Smartphone and Mobile Internet Device (MID) markets, Texas Instruments Incorporated (TI) (NYSE: TXN) announced today that it has extended its popular OMAP^TM 3 family with new 45 nanometer (nm) products. The new OMAP36x application processor family allows mobile device manufacturers to reuse their software investment in TI's popular 65 nm OMAP34x processor family and deliver higher performance computing with lower power consumption. The OMAP36x family of products will offer a range of performance levels, including speeds up to 1GHz, to address increased high performance needs of the MID market all while delivering the low power consumption required by these battery-powered products. The migration to 45 nm technology will also deliver more affordable solutions for mainstream Smartphones. (Visit www.ti.com/omap36x for more information.)

Features and benefits of OMAP36x family:

45 nm CMOS process technology delivers higher performance with lower power consumption versus the OMAP34x family, including an approximately 25% reduction in power and 75% improvement in graphics performance.
Robust multi-tasking platform that supports running multiple applications in parallel by simultaneously exercising the CPU, multimedia performance and 2D/3D graphics engines.
Dedicated 2D/3D graphics hardware accelerator, enabling more immersive user interfaces and compelling graphics for applications like realistic 3D gaming.
Smart pixel technology via OpenGL ES 2.0 delivers stunning imaging capabilities through advanced reflection effects and life-like facial features.
Supports multi-standard 720p HD functionality for HD video recording and playback.
Integrated image signal processor (ISP) supporting up to 12 megapixel (MP) imaging for enhanced photographic image quality and fast shot-to-shot camera performance.
Pre-integrated support for mobile connectivity, including TI's current and future combo WiLink^TM Wi-Fi solutions, NaviLink^TM GPS solutions, and BlueLink^TM Bluetooth(r) solutions.

OMAP36x family overview:

Part	Process Node	ARM Cortex-A8 Clock speed	Graphics Acceleration	Video Performance	Imaging Performance (per second)	Availability
OMAP3610	45 nm	720MHz	In software	VGA/DVD	12 MP	Samples in 3Q 2009.
OMAP3620	45 nm	720MHz	Hardware accelerated	VGA/DVD	12 MP	Samples in 3Q 2009.
OMAP3630	45 nm	720MHz	Hardware accelerated	720p HD	12 MP	Samples in 3Q 2009.
OMAP3640	45 nm	1GHz	Hardware accelerated	720p HD	12 MP	Samples in 3Q 2009.

Availability

The OMAP36x family of products is scheduled to sample in the third quarter of 2009. These products are intended for high-volume wireless OEMs and ODMs and are not available through distributors.

To find out more about the OMAP 36x family, visit the links below:

Technical information on the OMAP36x family: www.ti.com/omap36x_technical
Information on TI's 45 nm process technology: www.ti.com/45nm_omap3
OMAP36x family product bulletin: www.ti.com/omap36x_pb

What they're saying about the OMAP 3 platform:

"NEC plans to use TI's OMAP 3 platform for our near-term handset solutions, and we are pleased to see TI continue to invest in this family of products to address a range of performance needs and help us continue to deliver leading-edge, multimedia rich handsets to the market.

TI also makes it easy for us to support popular mobile operating systems like LiMo, further spurring innovative, creating applications to meet the appetites of consumers around the globe," said Mr. Yoshiharu Tamura, Executive General Manager, Mobile Terminals Business Unit, NEC.

Texas Instruments demonstrates new OMAP™ platform milestones on the Android Mobile Platform

NewsCenter — Mon, 16 Feb 2009 02:00:00 GMT

TI showcases the most advanced functionality on the Android framework leveraging OMAP application processors and connectivity portfolio

BARCELONA, Spain (Feb. 16, 2009) - Texas Instruments Incorporated (TI) (NYSE: TXN) announced today that it is demonstrating the latest Android mobile platform running on the newly announced OMAP 3 mobile development platform in its booth (Hall 8, 8A84) at Mobile World Congress. TI will demonstrate the most advanced features, functionality and performance available on the Android framework. Attendees will experience high-quality video and audio playback which leverages the flexibility of the OMAP^TM platform and integrated WiLink^TM connectivity solutions running on the Android mobile platform. TI is working with the Open Handset Alliance to address future market requirements with platform advancements that enrich the mobile user experience, including high definition (HD) multimedia, enhanced imaging, and 2D/3D hardware-accelerated graphics for Android-based devices. In addition, continuing its dedication to supporting open source, TI has launched new online resources to help OMAP developers further innovate and collaborate on the Android platform.

TI's Mobile World Congress demonstrations on the Zoom OMAP34x-II MDP include:

High-quality multimedia at WVGA resolution to support easy viewing of the latest Web and video content with extended playback time
Enhanced photo capture and viewer, supporting images up to 8 megapixel
High-performance Web browsing with super-fast Web page renderings and quick access utilizing Wi-Fi connectivity (802.11 b/g/n)
Platform support for integrated 3G modems, providing the flexibility for customers to select modem of choice

Continued investments on Android Platform

TI is working with the Open Handset Alliance, to further extend the capabilities of Android, the OMAP processor and TI connectivity solutions to deliver:

High-definition multimedia with support for video/audio record and playback
2D/3D hardware-accelerated graphics support for optimal power and performance
Support for additional connectivity technologies including 802.11n, Bluetooth®, FM receive, FM transmit and GPS
Commercial digital still camera quality image processing made possible with advanced imaging algorithms

For more information

To order a Zoom development platform and to begin developing on Android: www.ti.com/order_a_zoom
To learn about the new resources and work being done on Android: www.ti.com/androidproject.

Texas Instruments extends OMAP™ portfolio with multimedia coprocessor that boosts mobile imaging and video performance

NewsCenter — Mon, 31 Mar 2008 08:00:00 GMT

OMAP(TM)-DM coprocessors enable eight mega pixel still images and DVD-quality video capabilities in mobile phones

DALLAS (March 31, 2008) - A news-breaking event, a baby's first steps, a winning goal in the final seconds of a game are all milestones that occur in the blink of an eye and shape peoples' lives. In order to capture these important events spontaneously when they occur, consumers demand an ever-present device that delivers the vividness and accuracy they've come to expect from standalone cameras, and mobile phones are increasingly the answer. To address this demand, Texas Instruments Incorporated (TI) (NYSE: TXN) has expanded its OMAP^TM processor portfolio to include a line of coprocessors that boost the multimedia and imaging performance of mobile phones. The newest device in this family is the OMAP-DM510 coprocessor which improves the user experience of advanced handset capabilities with support for up to eight mega pixel still images and DVD-quality video capabilities. (For more information, visit www.ti.com/ctianews.)

The convenience and "always-with-you" aspect of the mobile handset is driving demand for imaging features and functionality similar to stand-alone digital still cameras, including high resolution (five mega pixel and above), automatic focus, flash, increased shot-to-shot performance and video recording capabilities. TI's OMAP-DM510 coprocessor delivers the performance necessary to take high quality images and video by using an embedded image signal processor (ISP) and video processors along with an ARM processor.
"Image signal processing has long been a strength of TI's, as the company pioneered some of the most advanced digital still camera solutions," said Raj Talluri, general manager for TI's Cellular Media Systems Solution business. "The OMAP-DM510 coprocessor, alongside the other OMAP-DM^TM products available today, extends this legacy to deliver camera phones with a digital still camera quality experience to both the mid-tier and high-end mobile handset markets."

Flexible solutions for a variety of market needs

The OMAP-DM coprocessors are highly flexible, scalable family of products and for handset manufacturers who want to address the mid-tier market, the OMAP-DM platform can easily be paired with a baseband modem to deliver imaging functionality when an applications processor is not required. For high-end mobile phones, the OMAP-DM coprocessors can also extend the capabilities of stand alone applications processors, such as an OMAP processor, improving the overall imaging and video performance of a handset by offloading the imaging and video functions from the existing applications processor.

High performance solution optimizes imaging for unique needs of mobile phones

In addition to supporting up to eight mega pixel still images, the OMAP-DM510 delivers extremely fast shot-to-shot performance, as well as three frames per second of burst mode performance. Along with advanced imaging capabilities, the OMAP-DM product line also offers high quality video, supporting up to DVD quality video at 30 frames per second for various video standards, including MPEG4 and H.264.

A high-quality camera phone experience is not only about solution performance, but about quality picture capture, which is more challenging given the limited dimensions of the mobile phone's form factor. This increases the need for image correction and enhancement, so technologies such as sensor and lens compensation, sharpening, red eye reduction and image stabilization become more important. Leveraging third party software from members of TI's OMAP Developer Network, handset manufacturers have access to even more enhancement features, including color compensation, blink detection, face detection and smile detection. The ability to integrate such options with the OMAP and OMAP-DM processors allows manufacturers to deliver advancements in the mobile user experience and further differentiate their devices in an increasingly competitive marketplace.

Demonstrations and availability

The OMAP-DM510 solution is sampling today with handsets expected to be on the market by early 2009. To learn more about TI's OMAP-DM product line as well as experience its capabilities, stop by TI's CTIA booth in Hall 4, booth 1048 or visit www.ti.com/wirelesspressroom.

TI senior vice president challenges industry to unlock innovation for friendlier, easier and smarter mobile user experience

NewsCenter — Mon, 11 Feb 2008 10:30:00 GMT

Greg Delagi says TI OMAP(TM) technology continues to stimulate new ways for users to access, view and share mobile content

BARCELONA, Spain (Feb. 11, 2008) - Texas Instruments Incorporated (TI) (NYSE: TXN) senior vice president Greg Delagi challenged the wireless industry to remove innovation barriers inhibiting a fully-realized mobile user experience. Speaking today at a press event at the Mobile World Congress, Delagi, who leads TI's Wireless Terminals Business Unit, said that TI's OMAP^TM application processor technology "continues to invigorate and transform the mobile user experience to be friendlier, easier and smarter" and is driving innovations in ways consumers access, view and share content on their mobile devices.
Delagi commented that "as an industry we've only just begun to scratch the surface of how important and helpful mobile devices will become to each and every one of us." The mobile phone has undergone a metamorphosis from a simple device used to make and receive calls, to a must-have consumer product, due largely to improvements in the user experience. He challenged the audience to "imagine the types of applications and usage scenarios that will come by unleashing the creative energy of thousands of developers around the globe delivering innovations that take full advantage of the power of wireless technology, especially TI's OMAP platform."
TI announced new innovations for mobile devices that include high-definition (HD) camcorder record capabilities - turning the handset into a HD camcorder; the ability for a mobile phone to deliver a full page Web browsing experience that rivals that of a PC; and production availability of the company's DLP Pico^TM chipset, which will bring consumers one step closer to a high-quality big picture experience on mobile phones. With the enriched content enabled by OMAP, combined with these expanded content viewing options, TI is enabling its customers to create new use cases for mobile devices, such as the ability to record a personal movie in HD on your handset and then view it in large screen format with friends and family.
"Even with all the high-end capabilities we have nurtured with our OMAP platform, there is still a great amount of innovation ahead of us," said Delagi. "TI believes the best is yet to come, and we're excited about the innovation that will be delivered on top of the OMAP platform to enhance the mobile user experience as wireless applications and services take a more central role in our daily lives."
To further help handset manufacturers provide compelling user experiences, TI also announced today new offerings that reduce barriers for innovation and make OMAP more accessible to a larger community of software developers. As part of the new offerings, TI is launching a low-cost, feature-rich OMAP 3-based development kit to ease creation of new applications for mobile devices. TI also announced an expansion of its open source initiatives, making documentation and software available among the robust Linux development community.
Delagi told the audience that the combination of these offerings will "fuel further innovation among the large wireless development community to harness the performance of the OMAP platform and drive breakthroughs in the mobile user experience."
To learn more about this announcement and other Mobile World Congress activities, please visit ww.ti.com/mwc2008.

TI's New OMAP™ 3 chip brings HD camcorder and rich full-page Web browsing to mobile devices

NewsCenter — Mon, 11 Feb 2008 10:30:00 GMT

Affordable OMAP-based development platform and Open Source initiative spur innovation among developers for Smartphones and Mobile Internet Devices

BARCELONA, Spain (Feb. 11, 2008) - Mobile technology from Texas Instruments Incorporated (TI) (NYSE: TXN) is revolutionizing the way consumers view and share content on their mobile handsets. TI's new OMAP3440 is the industry's first ARM Cortex A8-based applications processor to bring full HD camcorder functionality to mobile devices, giving users the ability to record high-definition (HD) video, as well as enjoy new applications enabled by the large displays in the latest Smartphones and Mobile Internet Devices (MIDs).
Consumers have become accustomed to experiencing high-quality video and full-page Web browsing at home, and TI's new OMAP3440 processor delivers the same compelling experiences to the mobile market. The new chip leverages TI's high performance IVA^TM multimedia accelerator to support 720p HD video record and playback, unleashing user creativity behind the lens. With integrated camcorder capabilities, consumers will be able to record HD video on-the-go - for playback on an HD television at home or to quickly post and share with friends from a mobile device.
The OMAP3440 also packs the optimal combination of high-performance and low-power to deliver a robust Web browsing experience for the burgeoning MID market, making it possible for consumers to view content in full-screen mode and enjoy content in any format. At the heart of the OMAP3440 is a superscalar ARM Cortex-A8 running at 800 MHz, providing the performance headroom to enhance applications that take advantage of larger displays in MIDs.
"TI's OMAP platform is designed to change and enhance the way consumers enjoy content on their phones, extending their experiences with consumer electronics and PCs into the more pervasive mobile environment," said Raj Talluri, general manager for TI's Cellular Media Systems Solution business. "Ideally suited for the stringent size and power requirements of mobile devices, TI believes the OMAP3440 applications processor is the perfect platform for developing new, innovative mobile user experiences."

New OMAP 3 hardware and software development tools fuel mobile innovation

TI is also introducing a new low-cost development kit aimed at stimulating innovation and fostering growth for OMAP-based Smartphones and MIDs. TI has teamed with LogicPD to launch the OMAP3430-based Zoom Mobile Development Kit (MDK). This cost-effective development platform, which can be used with a variety of operating systems, provides an affordable way for developers to quickly design on the OMAP 3 platform. The feature-rich development board includes:

TI's OMAP3430 applications processor;
TI's OMAP-Vox^TM cellular modem;
TI's wireless connectivity technology;
3-megapixel camera sensor;
3.7" VGA TFT touchscreen display; and
TV output and more.

Additionally, TI is expanding its Open Source Linux offering with an OMAP3430 board support package to further accelerate innovation on the OMAP platform amongst the large community of Linux developers. The new package, combined with the Zoom MDK, opens up a new universe of Open Source opportunities for the mobile developer community.

Demonstrations and availability

To learn more about TI's vision for the mobile user experience and Mobile Internet Devices, as well as experience OMAP 3-enabled demonstrations, stop by TI's Mobile World Congress booth, Hall 8, 8A84 or visit www.ti.com/mwc2008. To learn more about TI's solutions for the MID market, please visit www.ti.com/mid.

The OMAP3430 solution is sampling today, and the OMAP3440 processor will sample by second quarter 2008. The Zoom MDK is available in limited quantities today and will be broadly available in April 2008. Developers can get more information on TI's open source initiatives and information on the Zoom MDK at opensource.ti.com.

Texas Instruments to demonstrate Android Mobile Platform

NewsCenter — Mon, 11 Feb 2008 02:00:00 GMT

TI's OMAP application processors and connectivity portfolio together with Android open source platform spur creativity and differentiation in mobile device market

BARCELONA, Spain (Feb. 11, 2008) - Today at Mobile World Congress, Texas Instruments Incorporated (TI) (NYSE: TXN) announced it will demonstrate an early look of the Android mobile platform in two forms: a prototype handset based on TI's OMAP850 processor that also includes TI's Wireless LAN (WLAN) and Bluetooth&#174 wireless technology solutions, as well as an OMAP3430 processor-based Zoom Mobile Development Kit from Logic PD. Both demonstrations highlight the flexibility of the OMAP platform's multi-core architecture to deliver high-performance multimedia and sophisticated user interfaces (UI) on the Android platform.
Android, currently released as an "early look" to developers, is an open platform for mobile devices that includes an operating system, middleware and key applications, is designed to enable developers to create compelling mobile applications that maximize the fullest potential of an OMAP processor-based solution while allowing handset manufacturers and carriers to customize their solution quickly. The UI on this mobile platform will provide quick and easy access to the most important applications on the device including web browser, email, messaging and video. Using TI's WiLink^TM WLAN and BlueLink^TM Bluetooth technology, the Android mobile platform features integrated connectivity options that allow consumers to seamlessly connect to exciting, interactive applications. These demonstrations of the platform highlight how TI is pushing the limits of the mobile market, driving development of creative and unique applications for mobile devices through the support of open source activities such as those sponsored by the Open Handset Alliance.
"TI is pleased to be a member of the Open Handset Alliance, furthering our commitment to the open source community," said Avner Goren, worldwide director of strategic marketing, TI's Wireless Terminals Business Unit. "TI's OMAP applications engine provides the perfect combination for performance and power to deliver an optimized multimedia and UI experience in conjunction with Google's Android framework.
TI remains committed to serving the open source community and is an active participant in a number of open source foundations and organizations, including the Open Handset Alliance. TI actively designs and develops solutions for mobile device manufacturers, and continues to look for new ways to deliver innovative and compelling devices in an increasingly competitive market.

About Android

The Android framework, a complete mobile phone software stack, is designed to alleviate development challenges that continue to confront handset customers and handset silicon vendors looking to deliver differentiated solutions to market. As a part of an open support network, the Android solution reduces time to market, spurs innovation in a larger development community, and has the potential to reduce software cost.

Texas Instruments Wireless Technologies Selected by Samsung to Power Next-Generation Smartphones

NewsCenter — Tue, 30 Oct 2007 09:00:00 GMT

TI's OMAP(TM) Platforms and BlueLink(TM) Bluetooth(R) Solution Elevate Consumer Multimedia Experience

DALLAS (October 30, 2007) - Texas Instruments Incorporated (TI) (NYSE: TXN) today announced that its innovative wireless technologies have been selected by Samsung Electronics Co., Ltd. (Samsung) to drive compelling multimedia and connectivity into a variety of the mobile phone maker's handsets. Samsung's current engagement highlights TI's broad technology portfolio, utilizing first and second generations of TI's OMAP^TM platform and BlueLinkTM 5.0 Bluetooth(R) wireless technology products. With these technologies, Samsung is addressing a wide range of entertainment and productivity functions for consumers.
TI's OMAP1710 applications processor is the foundation for Samsung's award-winning Blackjack^TM handset and remains the cornerstone for future generations of its advanced mobile handsets. Samsung's newest HSDPA-enabled handset, the SGH-i620, utilizes the OMAP1710 processor to deliver leading-edge audio, video and imaging capabilities in a unique, slim, slider form factor. The OMAP1710 processor also supports full Internet browsing, MP3 music and support for secure digital high-capacity (SDHC) memory. In addition, the i620 features a full QWERTY keyboard and a second front-mount camera to support video calls.
"Samsung is committed to innovation in the handset market, delivering the most advanced and unique handsets with features demanded by consumers," said C.H. Lee, Senior Vice President, Samsung Mobile. "Using TI's high-performance, low-power applications processors and advanced connectivity solutions, Samsung delivers highly-optimized Smartphones that combine multimedia functionality and efficient connectivity features in small, stylish handsets."
Partnering with Texas Instruments, Samsung Mobile is ready to address the Symbian Smartphone market with compelling and highly-competitive products based on latest available versions of Symbian OS^TM and S60 software. The OMAP2430 processor is the engine for the Symbian OS-based SGH-i400 handset. This second-generation OMAP 2 processor allows consumers to enjoy full Internet browsing on a 2.3-inch "wide display," high-quality multimedia and 2 megapixel camera, on the i400's QVGA-resolution screen. The i400 phone also integrates TI's BRF6300 solution to deliver improved Bluetooth data transfer speeds up to 3Mbps and the benefit of wireless stereo headset support via the A2DP profile.
"We are pleased to deepen our relationship with Samsung and enjoy seeing the continued growth of the Samsung product line," said Raj Talluri, worldwide general manager for TI's Cellular Media Systems Solutions group. "Samsung is maximizing the capabilities of TI's OMAP platform and connectivity solutions to deliver some of the most advanced feature phones on the market today."

Chinese Manufacturers Amoi and TCL Leverage TI Technology for Handsets Shipping Around the Globe

NewsCenter — Tue, 25 Sep 2007 05:00:00 GMT

TI Marks a Decade of Support for China's Booming Wireless Market

SHANGHAI (Sept. 25, 2007) - Texas Instruments Incorporated (TI) (NYSE: TXN) today announced that two Chinese manufacturers are using TI integrated wireless technology for handsets shipping worldwide today. Amoi Electronics Co., Ltd. and TCL Communications Technology Holdings Limited (TCL) are using TI technology to bring a range of handsets to consumers around the world, from ultra low-cost phones to affordable, feature-rich smartphones. Amoi and TCL join a premier list of China-based TI customers, including Bird, Konka and Lenovo. TI is a long-time supporter of local Chinese manufacturers and was among the first wireless chipset suppliers to support the booming China mobile phone market with its first mobile phone design-win in 1998. Today's announcement builds on the long-term relationship TI already enjoys with Amoi and TCL.
Amoi continues to expand its series of EDGE handsets which are based on TI's OMAPV1030 EDGE solution, to deliver affordable smartphones for China and Europe. The OMAPV1030, part of TI's OMAP-Vox^TM family, is an integrated and optimized EDGE solution giving handset manufacturers the freedom to design affordable devices with the latest applications for the growing mid-range mobile phone market. Manufacturers such as Amoi are leveraging the OMAPV1030 solution to build smartphones at feature phone price points, giving more consumers access to these products, including those in high-growth economies and other cost-sensitive environments, such as small and medium-sized businesses.
"Amoi is very excited to deliver mass-market smartphones to more consumers than ever before," said Mr. Xie, Vice President, Amoi Electronics, Co, Ltd. "By using TI's OMAPV1030 solution, we are able to deliver feature-rich, enhanced multimedia smartphones for multiple markets at an affordable price."
TCL continues to leverage TI's 2.5G and DRP^TM technology-based LoCosto^TM single-chip solution as part of its roadmap to address the growing requirement for low-cost handsets. TCL selected the LoCosto single-chip platform to address a variety of region-specific operator requirements, end-user feature requirements and cost expectations in several high-demand markets around the globe. The LoCosto platform is a scalable family of solutions that enables manufacturers to deliver differentiated handsets for multiple market segments using the same technology platform. The LoCosto family has also become a platform for innovation, with multiple third parties developing advanced multimedia applications for the entry-level handset segment, such as 1.3 megapixel camera, MP3 playback and video.
"TCL has an increasingly global customer base with different user requirements and demands. TI's LoCosto platform has allowed us to maximize our engineering investment while enabling multiple products from a single platform," said Dr. Fei Liu, CEO of TCL Communication Technology Holdings Limited. "TI's scalable, flexible platform gives us the ability to deliver fashionable, affordable handsets for a variety of market needs - from Asia, to Europe and the Americas."

TI Committed to China Wireless Market

These design wins further illustrate TI's commitment to delivering innovative solutions for the China mobile phone market. In 2001, TI founded its Shanghai wireless design center, which it later extended to Beijing and Shenzhen. The following year, TI co-founded COMMIT, a joint venture aimed at growing China's 3G TD-SCDMA market. And most recently, TI received an award from the China Center of Electronics and Information Industry Development Research for "Outstanding Performance in the China Handset Industry" as part of the organization's China Handset Market 20th Anniversary ceremony.

As part of his remarks to Chinese technology innovators attending a TI-hosted China Wireless Summit in Shanghai today, Greg Delagi, senior vice president of TI's Wireless Terminals Business Unit, said: "With its insatiable entrepreneurial appetite, China is at the center of technology innovation and mobile development. A long-time supporter of the China market, TI is proud to continue working alongside our China customers as the Chinese market continues to boom, and remain wholly committed to investing in our customers' success."
TI is one of the leading wireless semiconductor suppliers to Chinese OEMs, with 7 of the top 8 local Chinese manufacturers using TI wireless technology. Additionally, 14 of the top 15 Asian ODMs and OEMs have chosen TI wireless technology, including Chi Mei, Compal, HTC and LGE.

Ericsson and Texas Instruments to Co-develop Innovative 3G Solutions for Handset Manufacturers

NewsCenter — Mon, 23 Jul 2007 13:30:00 GMT

DALLAS (July 23, 2007) -- Ericsson (NASDAQ:ERIC), the world's leading telecom supplier, and Texas Instruments Incorporated (TI) (NYSE:TXN), the global leader in silicon solutions for wireless communications, today announced that the companies will form a strategic technology engagement to develop custom solutions for new Open OS enabled 3G devices.
Solutions from the technology created by the two companies will combine small and power efficient 3G modems from Ericsson Mobile Platforms with high-performance OMAP^TM applications processors from TI. Solutions from the joint engagement will include OMAP, custom basebands and connectivity technologies and will be capable of supporting the major Open OS, which offer easy access to a rich array of applications and services. The result of this joint effort will enable all device manufacturers to offer advanced Open OS handsets for both the high-end and the rapidly growing mid-range market.
The collaboration between Ericsson and TI will enable handset manufacturers to deliver the exciting mobile entertainment and multimedia experiences that consumers around the world are increasingly demanding. Ericsson's access technology leadership, current HSPA-enabled platforms, and future HSPA evolution and LTE technologies, combined with the cutting-edge multimedia performance enabled by TI's OMAP 2, OMAP 3 and future generations of OMAP processors, will continue to push the performance boundaries of mobile devices and mobile entertainment features.

By leveraging TI's OMAP platform with Open OS support for Windows&#174 Mobile, Symbian S60, Symbian UIQ and Linux&#174, these solutions will provide OEMs and operators with a robust and flexible architecture for applications and services deployment, enabling easier delivery and management of services and content. This enables handset manufacturers and mobile operators to differentiate their products through rich, easy-to-use and customizable user interfaces, and through a robust and flexible application architecture.

The result of the joint effort will bring to market an evolving portfolio of wireless technology platforms with Open OS support to reduce complexity, investment and time-to-market for device manufacturers. The solutions, which seamlessly integrate the modem and applications processor, will be presented in one pre-verified and tested platform reference design. This approach will drastically reduce development and verification efforts previously undertaken by device manufacturers, enabling customers to rapidly bring highly advanced yet competitively priced products to market.
The joint solutions will also benefit from the Ericsson Mobile Platforms IOT program, one of the industry's most extensive interoperability testing processes, guaranteeing full compliance with operator requirements, speeding up time to market and securing an easy roll-out of products.
Greg Delagi, senior vice president of TI's Wireless Terminals Business Unit, says: "It's a tribute to the long-standing collaborative relationship between EMP and TI that we can tap into and combine each company's unique wireless expertise in order to deliver the most timely, targeted solutions to the market. TI's broad, proven product portfolio and advanced manufacturing capabilities have continued to adjust to the demanding requirements of EMP's customer base. We believe that today's announcement will build on what TI can bring to EMP and what both companies together can bring to this vital, dynamic industry."
Robert Puskaric, head of Ericsson's mobile platforms' unit, says: "Ericsson is clear in its commitment to design and offer a portfolio of flexible, innovative mobile platforms that address the requirements of the rapidly evolving mobile device market. We are pleased to work closely with TI to combine the finest of each company's core wireless know-how - EMP's access technology and platform size leadership with TI's innovative OMAP application processors in order to provide the most capable Open OS platforms on the market today."
Handsets based on these solutions are expected to be available on the market in the second half of 2008.

Texas Instruments Recognized with Microsoft Windows Embedded Partner Excellence Award

NewsCenter — Tue, 01 May 2007 08:30:00 GMT

TI Acknowledged for Development of Windows Embedded CE-based Solutions on DaVinci(TM) Technology and OMAP(TM) Platform

LAS VEGAS (May 1, 2007) -- Texas Instruments Incorporated (NYSE: TXN) (TI) today announced that it was awarded the North American Windows Embedded Partner Excellence Award 2007 by Microsoft during the Microsoft Mobile & Embedded Developers Conference. TI earned the recognition in the silicon category for Windows Embedded CE innovation with DaVinci^TM technology and the OMAP^TM platform.
The Windows Embedded Partner Excellence Awards, previously called the Windows Embedded Partner of the Year Awards, recognize visionaries and organizations around the world that use technology in an innovative and creative manner.
Microsoft selected TI for its work on multiple embedded platforms for both vertical embedded markets as well as the broader market. This includes DaVinci technology and the OMAP processor family, which are supported by an extensive global support ecosystem, including a number of Microsoft embedded partners.
"Microsoft is pleased to recognize TI for the solutions it delivers to customers across multiple markets in the Windows Embedded ecosystem," said Ilya Bukshteyn, director of Windows Embedded Marketing at Microsoft Corp. "TI's DaVinci technology and OMAP platform enable manufacturers to quickly bring to market innovative and powerful multimedia-rich devices based on Windows Embedded solutions."
TI and Microsoft achieved significant milestone events during the past year. Working to meet the needs of digital video developers, TI ported Windows Embedded CE to the TMS320DM644x processors for DaVinci technology this year. This effort significantly expanded the reach of the popular operating system to designers who want to leverage the power of digital signal processing in their designs. Through familiar environments, such as Microsoft DirectShow and Windows Media Player, developers can access the DaVinci codec engine and DSP/BIOS^TM Link without having to manage the details of hand tooling the DSP core.
"TI remains committed to delivering solutions that foster development of high-quality, multimedia experiences that blend the features of the Windows Embedded operating systems with the performance of TI's DaVinci and OMAP offerings," said Greg Mar, SoC Platform Marketing manager, TI. "This award from Microsoft recognizes the work of our organization to bring the highly demanded Windows Embedded CE to our customers."
TI and Microsoft engagements in the embedded market are a natural extension of other strong existing collaborations between the companies that encompass several OMAP and OMAP-Vox^TM platforms in the mobile market. For the embedded market, TI's OMAP2420 applications processor was the first ARM11^TM-based development platform for Windows Embedded CE 6.0. This solution delivers compelling advances for rich multimedia, 3D graphics and system integration for consumer electronics devices, while reducing power consumption. In the mobile market, TI's OMAP 2 applications processors are enabling exciting new enterprise and multimedia experiences for the mobile information worker in Windows Mobile 6-based handsets shipping later this year. TI and Microsoft collaborated on market-leading OMAP-Vox platforms to deliver Smartphone functionality at competitive feature phone prices. Low-cost Windows Mobile-powered Smartphones based on the OMAPV1030 solution are now shipping from Amoi Electronics.

DLP® Projection Technology Goes Even More Mobile

NewsCenter — Mon, 26 Mar 2007 08:00:00 GMT

Texas Instruments Demonstrates Vision for Future of Viewing Mobile Content Based on New DLP Pico-Projection Technology

ORLANDO (March 26, 2007) -- Texas Instruments (TI) (NYSE: TXN) during the 2007 CTIA Wireless convention will be demonstrating, to select media, a prototype of a DLP® pico-projector small enough to fit on your finger tips. The latest DLP innovation from the world leader in mobile projection solutions enables compelling viewing options that expand beyond the limitations of a physical screen for mobile users of cellular phones, digital cameras and portable media players.
DLP pico-projectors, either as standalone projector or as an integrated component in mobile devices, will provide consumers and business professionals with the flexibility to share video and graphic content in a larger way.
The DLP pico-prototype further advances TI's mobile projection technology, building on the 2006 introduction of DLP-based pocket projectors. These products are in the market today from manufacturers, including Mitsubishi, Samsung, and Toshiba. Pacific Media Associates (PMA), a global research firm, expects this pocket projector category to grow to more than 1M units by 2010. TI demonstrated the viewing experience advantage of showing mobile phone content on a pocket projector in January 2007. The introduction of the pico-projector capabilities will provide manufacturers and end-users even more options on how they can view and share information and content.
"As the leader in home theater and business projection, TI DLP Products continues to develop new and exciting ways that our manufacturing customers can apply DLP technology in innovative consumer products," said Frank J. Moizio, Worldwide Strategic Marketing and Business Development Manager, TI DLP Front Projection. "Over the next few years, we envision a large opportunity for the convergence of projection technology and mobile devices, like cell phones," Moizio added.
Now in addition to using TI's world leading OMAPTM processor technology for processing video and graphics content, mobile manufacturers can take advantage of TI DLP pico-projection technology as a new and enhanced display option in their devices. As the OMAP wireless application platform has helped revolutionize processing of media content on mobile devices, DLP pico-projection technology will advance the viewing experience of mobile devices providing significant improvements in productivity and entertainment experiences.
Key benefits of DLP projectors include: smoother images with no "screen door" effect; crisp and clear presentation of fast motion video; vibrant colors created by its BrilliantColor technology; and proven reliability across all facets - picture reliability over time (no fading, yellowing or color decay over time as compared to other display technologies), overall performance and dust-resistance.

Texas Instruments and Ideaworks3D "OpenKODE®-Ready" OMAP™ Gaming Platform to Drive Premium Multimedia and Gaming Capabilities

NewsCenter — Thu, 01 Mar 2007 06:00:00 GMT

Enhanced Platform Simplifies Development Process to Quickly Deliver Games to Multiple Handset Market Segments

DALLAS (March 1, 2007) -- Texas Instruments Incorporated (TI) (NYSE: TXN) and Ideaworks3D are extending the capabilities of the OMAP^TM Gaming Platform to support the OpenKODE® 1.0 specification, addressing a wider market targeting feature phones to high-end multimedia handsets. This platform will be one of the first in the industry to incorporate the OpenKODE Khronos Open Development Environment to further simplify the development and deployment of new games across multiple mobile phone segments, creating a larger market opportunity for game publishers.
To enable developers to address the broadest possible market, the gaming platform has been expanded to include TI's OMAP 2 and OMAP-Vox^TM product families. Additionally, the offering spans both accelerated and non-accelerated 3D graphics solutions using a common development and deployment environment through Ideaworks3D's Airplay^TM software.
The Ideaworks3D Airplay SDK is optimized to take advantage of TI's OMAP2430 and OMAPV1030 processor capabilities, while maintaining cross-platform portability. The SDK on TI's OMAP2430 processor takes advantage of hardware-enabled 3D graphics to provide a premium gaming experience. The Airplay SDK on TI's OMAPV1030 processor utilizes software graphics renderers to enable compelling casual games for the feature phone market. Both platforms exceed the performance guidelines being defined in a mobile gaming white paper currently under development by the Open Mobile Alliance^TM Games Services working group. The platform will scale to support future standards such as OpenGL® ES 2.0 with TI's OMAP 3 product family.
"Game developers will see dramatic reductions in development costs by utilizing the TI and Ideaworks3D gaming platform," said Alex Caccia, CEO, Ideaworks3D. "We have found that game developers can achieve up to 60 percent cost savings for development and porting of mobile games using Airplay SDK on TI's OMAP and OMAP-Vox platforms."
One of the most significant benefits of the TI and Ideaworks3D solution is that it changes the current mobile gaming development process by allowing developers to create one game binary which runs on leading open operating systems, including Symbian OS^TM, Linux® and Microsoft® Windows Mobile®. This enables the same code to run on a range of handsets with performance on par with other native applications.
"Support for open standards including OpenKODE, OpenGL ES and the OMA mobile gaming white paper is important to advance the development of mobile games," said Avner Goren, marketing director of Texas Instruments Cellular Systems Solutions. "We view these open standards as vital to the success of the mobile gaming market and TI will continue to enhance the mobile gaming platform with Ideaworks3D to help developers quickly deliver new and compelling games to market."
For handset manufacturers and operators there are distinct benefits to using the combined TI and Ideaworks3D gaming platform. This includes a reduction in porting costs and development time, as well as enabling the development of higher quality games that can be used on a broader range of handsets. Due to the portability benefits of the gaming platform, handset manufacturers can instantly tap into a larger catalog of mobile games by integrating the Airplay SDK into their products, rather than porting and validating games on each new handset. For operators, the Airplay SDK allows premium native games to be delivered to handsets using their existing Java-based content delivery platforms. The robust security mechanisms provided by TI's M-Shield^TM technology ensures that platform security is maintained when installing premium native games.
At the Game Developers Conference, March 5-8, TI and Ideaworks3D will be demonstrating the scalability of the Airplay SDK on TI's OMAP 2 and OMAP-Vox platforms in the Khronos booth 160 WH, 260 WH.